SISPAD 2017

http://en.kamakura-info.jp/
September 7-9    Kamakura, Japan
Technical Co-sponsored by The IEEE Electron Device Society

Important Dates :
  • April 10, 2017 - Abstract Submission Deadline (Extended)
  • May 31, 2017 - Notification of Acceptance
  • June 30, 2017 - Final Paper Submission Deadline
  • July 31, 2017 - Early Registration Deadline
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.

The 22nd SISPAD will be held on September 7-9, 2017 in Kamakura, Japan.

News :
Mar. 29, 2017   Abstract submission deadline has been extended.
Feb. 24, 2017   List of the plenary speakers is available here.
Jan. 20, 2017    The SISPAD abstract submission site is now open.