SISPAD 2017

http://en.kamakura-info.jp/
September 7-9    Kamakura, Japan
Technical Co-sponsored by The IEEE Electron Device Society

Important Dates :
  • April 14, 2017 - Abstract Submission Deadline (Re-extended)
  • May 31, 2017 - Notification of Acceptance
  • June 30, 2017 - Final Paper Submission Deadline
  • July 31, 2017 - Early Registration Deadline
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.

The 22nd SISPAD will be held on September 7-9, 2017 in Kamakura, Japan.

News :
July 18, 2017   Technical Program is available here.
May 12, 2017   List of the invited speakers is available here.
Apr. 12, 2017   Information of Workshops has been updated.
Apr. 10, 2017   Abstract submission deadline has been re-extended.
Mar. 29, 2017   Abstract submission deadline has been extended.
Feb. 24, 2017   List of the plenary speakers is available here.
Jan. 20, 2017    The SISPAD abstract submission site is now open.