Professional Experience

 

Education

  • Ph.D. Electrical and Computer Engineering, 2005 - 2009:University of Rochester, Rochester, NY. 
  • M. S. Electrical and Computer Engineering, 2003 -  2005: University of Rochester, Rochester, NY.
  • B. Tech. Electrical Engineering (with honor), 2000 - 2003: Ort Braude College, Karmiel, Israel.
  • B. S. Mechanical Engineering, 1995 - 1999: Technion - Israel Institute of Technology, Haifa, Israel.

Professional experience

Intel Corporation, Hillsboro, OR, 9/2010 - current

  • Power delivery analysis and design
  • Board, package, and die co-design
  • Package and die PDN modeling and simulation
  • DC-DC power conversion analysis and design
  • Analog design
  • Decoupling capacitors

Eastman Kodak, Rochester, NY, 6/2007 - 9/2007

  • Summer Internship
  • Design of a differential difference amplifier (DDA)
  • Design of a multiple ramp ADC for CMOS pixel sensors

Intrinsix Corporation, Fairport, NY, USA, 8/2005 - 11/2005

  • Summer internship
  • Mixed signal design
  • Gm-C based Σ∆-modulator ADC for FM tuner

University of Rochester, NY, USA, 8/2002 - 2/2003

  • Internship in the Department of Electrical and Computer Engineering
  • Low power bulk-driven amplifier design

Camtek, Migdal-Haemek, Israel, 2/2000 - 10/2000

  • Traveling abroad to different customer sites
  • Providing periodic maintenance of scanning machines
  • Providing different engineering solution to fit costumers needs

HAM-LET, Nazareth, Israel, 9/1999 - 3/2000

  • Process Developing Engineer
  • Conducting tests on different polished materials
  • Conducting research on electro-chemical polish methods