Research Interests:

  • Design and measurement of high-speed, low-power electronic circuits, microwave devices and signaling links
  • Signal integrity in electronic packaging and interconnect technology
  • Chip-Package-PCB co-design of mixed-signal circuits

Current Projects:

  • Design of a multimode transceiver for high-speed parallel chip-to-chip signaling links


Past Projects:

  • Implemented an on-chip oscilloscope for signal integrity characterization of interconnects in 0.13um technology (custom chips fabricated in collaboration with UMC Foundry)
  • Developed a custom system for testing high performance A/D converters (resulting in MS Thesis at UIUC)