The 2nd IEEE International Workshop on

Networks of Sensors, Wearable, and Medical Devices 

https://sites.google.com/site/NSWMD2017/

Co-located with

IEEE Local Computer Networks Conference  

(LCN 2017 )

Singapore, October  9-12, 2017



The 2nd IEEE International Workshop on Networks of Sensors, Wearable, and Medical Devices (NSWMD) held in association with IEEE LCN 2017. This workshop provides an international forum for the research community working in the area of energy efficient, green, safe, and reliable connected health research areas.

Topics of interest include, but are not limited to:

  • Networks of medical sensors.
  • Communication and networking issues in wearable devices.
  • Physical layer issues in networks of medical sensors and wearables.
  • Routing and transport protocol design issues.
  • Mobility effect on networking of medical devices.
  • Communication issues in medical devices.
  • Body area sensor networks.
  • WSN for medical applications.
  • RFID technology and medical applications.
  • Integrating wearables and medical sensors with networks infrastructures.
  • Integration of wearables and medical sensors with cloud systems.
  • Energy optimization in wearables and medical sensors.
  • Security and privacy issues in networks of medical devices. 
  • Authentication in wireless body networks.
  • Secure WBSN communications.
  • Data security and privacy in eHealthcare.
  • Secure connectivity in wearable devices.
  • eHealthcare security challenges in the cloud.
  • Trustworthy wearable sensing devices.
  • Simulation and formal analysis of networks of medical devices.
  • Surveys and state of the art reports in the area.

Submission Instructions

Submitted papers must be neither previously published nor under review by another workshop, conference or journal.

Only electronic submissions in PDF will be accepted. Submitted regular papers must be written in English, must be no longer than 8 pages in 10-point font, must render without error using standard PDF viewing tools, must print on US-Letter-sized paper, and must include the author names and affiliations in the first page. One extra page is allowed for additional charge of $100.

Submitted manuscripts may not exceed 8 single-spaced double-column pages using 10-point size font on 8.5x11 inch pages (IEEE conference style), including figures, tables, and references. See style templates for details: IEEE Manuscript Templates for Conference Proceedings

The authors of regular papers will deliver oral presentations. The authors of demo and poster papers will deliver system demonstrations and poster presentations, respectively. All accepted papers will be published by IEEE and indexed by IEEExplore.


Submission page

 Submission page: please use the following page on edas systemhttp://edas.info/N23388


Important Dates

- Paper Submission Deadline: May 12 2017

- Notification of Acceptance: July 10, 2017

- Deadline for Camera-ready Papers: August 10, 2017


Work Chairs and Organization Committee:
  • Amjad Gawanmeh, Khalifa University, UAE. Workshop Co-chair.
  • Joel Rodrigues, National Institute of Telecommunications (Inatel), Brazil and Instituto de Telecomunicações, Portugal.
  • Kashif Saleem, Center of Excellence in Information Assurance (CoEIA), King Saud University, KSA
  • Tanveer Zia, Charles Sturt University, Austalia, Workshop Co-chair.
  • Shihab Jimaa , Khalifa University, UAE. Program chair.
  • Zahoor Khan, Higher Colleges of Technology, UAE. Publicity chair.

TPC Members:
  • Aldar Chan, Institute for Infocomm Research, Singapore
  • Hamada Alshaer The University of Edinburgh, UK
  • Mubashir rehmani: COMSATS Institute of Information Technology, Pakistan
  • Berk Canberk, Istanbul Technical University, Turkey
  • Moad Mowafi Jordan University of Science and Technology, Jordan
  • Omar Alfandi, Zayed University, UAE
  • Kalman Graffi Heinrich Heine University Düsseldorf, Germany
  • Mehdi Adda University of Quebec at Rimouski
  • Marinella Petrocchi, istituto di Informatica eTelematica, CNR, Italy
  • Al-Sakib Khan Pathan Islamic University in Madinah, KSA
  • Moh'd Alwadi, The University of Canberra , Australia.
  • Masahide Nakamura Kobe University Japan.
  • Yaser Jararweh, Jordan University of Science and Technology.
  • Lei Chen, Georgia Southern University, USA.
  • Kun-chan Lan National Cheng Kung University, Taiwan
  • Jiankun Hu, University of New South Wales, Australia
  • Kanwalinderjit Gagneja, Southern Oregon University & North Dakota State University, USA
  • Wucherl Yoo,  Lawrence Berkeley National Laboratory, USA
  • Jawwad Shamsi, National University of Computer and Emerging Sciences, Pakistan
  • Majida Alasady, Universityof Tikrit, Iraq.
  • Ali Alwadi,  Auckland University of Technology, New Zealand.
  • Salam Dhou, Harvard Medical School, Boston USA.
  • Ibrahim Khalil, RMIT, Australia
  • Sim-Hui Tee Multimedia University, Malaysia
  • Sherali Zeadally, university of Kentucky, USA
  • shanshan chen university of Virginia, USA
  • Hamid Mcheick, University of Québec at Chicoutimi, Canada
  • Antonio Guerrieri, Università della Calabria, Italy. 
  • Rabeb Mizouni, Khalifa University, UAE.     
  • Toshiyuki Maeda, Hannan University, Japan 
  • Rafiqul Islam, Charles Sturt University, Austalia
  • Meryeme Ayache, ENSIAS, UM5S, Morocco
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IMPORTANT IEEE POLICY ANNOUNCEMENT
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The IEEE reserves the right to exclude a paper from distribution after the conference (including its removal from IEEE Xplore) if the paper is not presented.

Note: To be published in the IEEE LCN Workshop Proceedings and to be eligible for publication in IEEE /Xplore®/, an author of an accepted paper is required to register for the workshop and the paper must be presented by an author of that paper at the workshop unless the TPC Chair grants permission for a substitute presenter arranged in advance of the event and who is qualified both to present and answer questions. Non-refundable registration fees must be paid prior to uploading the final IEEE formatted, publication-ready version of the paper.  Papers will be published in the IEEE LCN 2017 Proceedings and submitted to IEEE /Xplore®/.