Updated statistics on google scholars.
M. S. Al Farisi, T. Tsukamoto, S. Tanaka: submitted (2020).
M. S. Al Farisi, T. Tsukamoto, S. Tanaka: "Tailoring material properties of electrochemically deposited Al film from chloroaluminate ionic liquid for microsystem technology using pulsed deposition," Sens. Act. A Phys. 316, p. 112384 (2020).
M. S. Al Farisi, H. Hirano, S. Tanaka: "Zero-Balance Method for Evaluation of Sealed Cavity Pressure Down to Single Digit Pa Using Thin Silicon Diaphragm," J. Microelectromech. Syst. 29 (3), pp. 418–426 (2020).
M. J. Khan, T. Tsukamoto, M. S. Al Farisi, S. Tanaka: "Fabrication Method of Micromachined Quartz Glass Resonator Using Sacrificial Supporting Structures," Sens. Act. A Phys. 305, p. 111922 (2020).
Y. Sato, A. Kobayashi, M. S. Al Farisi, T. Wanxin, K. Sugiyasu, M. Matsumoto: submitted (2019).
T. Seki, M. S. Al Farisi, H. Tetsuka, S. Ishibashi, Y. Kumagai, N. Araya, M. Kuri: "Support activities aimed at dissemination of voluntary and sustainable education for disaster mitigation: an example of the Disaster Mitigation Action Card Game", Tohoku J. Natural Disaster Sci. 55, pp. 209–214 (2019).
In Japanese: 関亜美, M. S. Al Farisi, 手塚寛, 石橋信治, 熊谷裕太, 新谷直己, 久利美和: "自主的・持続的な防災教育活動の普及を目指した実施支援 －減災アクションカードゲームを例にー" 東北地域災害科学研究 55 pp. 209–214.
H. Tetsuka, M. S. Al Farisi, T. Seki, Y. Kumagai, N. Araya, K. Miyanabe, M. Kuri: "Investigation of effective education for disaster mitigation by utilizing liquefaction experiment", Tohoku J. Natural Disaster Sci. 55, pp. 203–208 (2019).
In Japanese: 手塚寛, M. S. Al Farisi, 関亜美, 熊谷裕太, 新谷直己, 宮鍋慶介, 久利美和: "液状化実験を活用した効果的な防災教育の検討" 東北地域災害科学研究 55 pp. 203–208.
M. S. Al Farisi, S. Hertel, M. Wiemer, T. Otto: "Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid towards Microsystems Application", Micromachines 9 (11), p. 589 (2018).
M. S. Al Farisi, H. Hirano, S. Tanaka: "Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging," Sens. Act. A Phys. 279, pp. 671–679 (2018).
R. Kaneko, M. S. Al Farisi, S. Yamada, M. Kuri: “Evaluation of the Disaster Mitigation Action Card Game for International Students in Japan”, Tohoku J. Natural Disaster Sci. 54, pp. 279-284 (2018).
Journal title in Japanese: 東北地域災害科学研究.
M. S. Al Farisi, H. Hirano, J. Frömel, S. Tanaka: "Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting," J. Micromech. Microeng. 27 (1), p. 015029 (2017).
M. S. Al Farisi, T. Tsukamoto, S. Tanaka: "Influence of Additive Inclusion on Hardness of Electroplated Al Film with Nanometer-Level Flatness from Chloroaluminate Ionic Liquid" In Pacific Rim Meeting on Electrochemical & Solid State Science (PRiME) 2020, p. G05-1792 (2020).
S. Wang, M. S. Al Farisi, T. Tsukamoto, S. Tanaka: "Roll/Pitch Rate Integrating MEMS Gyroscope Using Dynamically Balanced Dual-Mass Resonator", In 2020 IEEE Int. Symp. Inertial Sensors and Systems (INERTIAL), pp. 1–4 (2020).
M. S. Al Farisi, H. Hirano, S. Tanaka: "Sealed cavity pressure evaluation from 1 Pa to over 10 kPa using thin diaphragm for MEMS vacuum packaging", In 2019 IEEE 32nd Int. Conf. Micro Electro Mechanical Syst. (MEMS), pp. 1045–1048 (2019).
M. S. Al Farisi, S. Hertel, M. Wiemer, T. Otto: “Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application”, In 2018 Int. Conf. Electron. Packaging iMAPS All Asia Conf. (ICEP-IAAC), pp. 415–418 (2018).
M. S. Al Farisi, K. Tanaka, H. Hirano, S. Tanaka: "250°C wafer-level vacuum sealing using electroplated copper bonding frame planarized by fly-cutting," In Solid-State Sensors Actuators and Microsystems (TRANSDUCERS), 2017 19th Int. Conf., pp. 1191–1194 (2017).
M. S. Al Farisi, H. Hirano, S. Tanaka, H. Miura: "Grain refining of metal surface by mechanical cutting for low-temperature wafer-level vacuum bonding," In 2nd USTB-TU Joint Workshop on Advanced Materials and Manufacture, Abstracts 2 p. 6 (2017).
M. S. Al Farisi, H. Hirano, S. Tanaka: "Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps," In Nano/Micro Engineered and Molecular Systems (NEMS), 2016 11th IEEE Int. Conf., pp. 573–577 (2016).
M. S. Al Farisi, T. Tsukamoto, S. Tanaka: "Wafer-level thermocompression bonding using electroplated Al thin film", In the 11th Symp. Micro-Nano Science and Technology, p. 27A2-MN1-4 (2020).
Conference title in Japanese: 第11回マイクロ・ナノ工学シンポジウム.
M. J. Khan, T. Tsukamoto, M. S. Al Farisi, S. Tanaka: "Electromagnetically Actuated Quartz Glass Ring Resonator for Mode Matched Gyroscope", In the IEEJ Micromachine and Sensor System Workshop, p. MSS-20-022 (2020).
Conference title in Japanese: 令和2年度電気学会 マイクロマシン・センサシステム研究会
S. Wang, M. S. Al Farisi, T. Tsukamoto, S. Tanaka: "Out-of-plane resonator for roll/pitch rate integrated gyroscope with dynamically balanced dual-mass", In the 55th Annual Meeting of the Japan Society of Mechanical Engineers Tohoku Branch, p. 182 (2020).
Conference title in Japanese: 日本機械学会東北支部 第55期総会・講演会.
M. S. Al Farisi, T. Tsukamoto, S. Tanaka: "Investigation of Mechanical and Electrical Properties of Electroplated Aluminum Film from AlCl3-[EMIm]Cl Ionic Liquid", In the 36th Sensor Symp. Sensors, Micromachines and Applied Systems, p. 20am2-LN2-73 (2019).
Conference title in Japanese: 第36回「センサ・マイクロマシンと応用システム」シンポジウム.
S. Wang, M. S. Al Farisi, T. Tsukamoto, S. Tanaka: "Dynamically Balanced Out-of-Plane Resonator for Roll/Pitch Rate Integrating Gyroscope", In the 36th Sensor Symp. Sensors, Micromachines and Applied Systems, p. 20am2-LN2-77 (2019).
Conference title in Japanese: 第36回「センサ・マイクロマシンと応用システム」シンポジウム.
M. J. Khan, T. Tsukamoto, M. S. Al Farisi, S. Tanaka: "Fabrication Method of Micromachined Quartz Resonator Using Temporal Au Supporting Structures", In the 10th Symp. Micro-Nano Science and Technology, p. 19pm5-PN3-42 (2019).
Conference title in Japanese: 第10回マイクロ・ナノ工学シンポジウム.
Y. Sato, A. Kobayashi, M. S. Al Farisi, T. Wanxin, K. Sugiyasu, M. Matsumoto: "Investigation on Relief Supplies for Home Evacuees after the Great East Japan Earthquake —Case of Iwaki City, Fukushima Prefecture—", In the Great East Japan Earthquake Workshop Series of the Institute of Social Safety Science, p. A-6 (2019).
In Japanese: 佐藤悠司, 小林陽成, M. S. Al Farisi, 唐万新, 杉安和也, 松本行真, "東日本大震災における在宅避難者への 物資支援に関する調査と考察 —福島県いわき市を対象として—", 地域安全学会東日本大震災連続ワークショップ 2019, p. A-6.
T. Seki, M. S. Al Farisi, H. Tetsuka, S. Ishibashi, Y. Kumagai, N. Araya, M. Kuri: "Support activities aimed at dissemination of voluntary and sustainable education for disaster mitigation: an example of the Disaster Mitigation Action Card Game", In 2018 Tohoku Natural Disaster Sci. Conf., pp. 14–15 (2018).
In Japanese: 関亜美, M. S. Al Farisi, 手塚寛, 石橋信治, 熊谷裕太, 新谷直己, 久利美和, "自主的・持続的な防災教育活動の普及を目指した実施支援 －減災アクションカードゲームを例にー" 平成30年度東北地域災害科学研究集会 pp. 14–15.
H. Tetsuka, M. S. Al Farisi, T. Seki, Y. Kumagai, N. Araya, K. Miyanabe, M. Kuri: "Investigation of effective education for disaster mitigation by utilizing liquefaction experiment", In 2018 Tohoku Natural Disaster Sci. Conf., pp. 5–6 (2018).
In Japanese: 手塚寛, M. S. Al Farisi, 関亜美, 熊谷裕太, 新谷直己, 宮鍋慶介, 久利美和, "液状化実験を活用した効果的な防災教育の検討"平成30年度東北地域災害科学研究集会 pp. 5–6.
H. Tetsuka, Y. Kumagai, N. Araya, T. Seki, M. S. Al Farisi, K. Miyanabe, M. Kuri: “Education for Disaster Mitigation by Utilizing Liquefaction Experiment”, In Japan Geoscience Union (JpGU) Meeting 2018, O05-01 (2018).
In Japanese: 手塚寛, 熊谷裕太, 新谷直己, 関亜美, M. S. Al Farisi, 宮鍋慶介, 久利美和, "液状化実験を活用した防災教育", 日本地球惑星科学連合2018年大会, O05-01.
R. Kaneko, M. S. Al Farisi, S. Yamada, M. Kuri: “Evaluation of the Disaster Mitigation Action Card Game for International Students in Japan”, In 2017 Tohoku Natural Disaster Sci. Conf., pp. 112–113 (2017).
Conference title in Japanese: 平成29年度東北地域災害科学研究集会.
M. S. Al Farisi: "Wafer-Level Vacuum Packaging Using Electroplated-Planarized Metal Bonding," In Nanotechnology Platform Student Training Program, Tohoku University (2017).
Outstanding Technical Paper Award, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (17 – 21 April 2018), Kuwana, Japan.
Japan Oil, Gas and Metals National Corporation (JOGMEC) Award, Academic City (Sendai City, Miyagi Prefecture) Science Day 2017 (16, 21 July 2017), Sendai, Japan.
JOGMEC賞, 学都「仙台・宮城」サイエンス・デイ2017.
Ofunato Trading Hall Award, Disaster Prevention & Mitigation Contest (25 February 2017), Sendai, Japan.
大船渡伝承館賞, 被災地と共に考える 防災・減災コンテスト2016年度.
Best Poster Award, 2nd USTB-TU Joint Workshop on Advanced Materials and Manufacture (21 – 24 February 2017), Beijing, China.
Japan Society for the Promotion of Science (JSPS) fellowship for young scientist (DC2 scheme), April 2019 – March 2021. (PI) Project title: Electroplated aluminum thermal actuator with large force output for a micro position control system. Budget: JPY 1,800,000,-.
日本学術振興会 特別研究員奨励費（研究代表者）
課題名：マイクロ位置決めシステムのための大きな発生力めっきアルミニウム熱アクチュエータ
研究期間：2019年4月〜2021年3月 総額：1,800千円
Tohoku University Division for Interdisciplinary Advanced Research and Education (DIARE), April 2018 – March 2021. (PI) Project title: Micro position control system using electroplated aluminum thermal actuator with large force output. Budget: JPY 1,700,000,-.
国立大学法人 東北大学 学際高等研究教育院 研究経費（研究代表者）
課題名：大きな発生力を有するめっきアルミニウム熱アクチュエータを用いたマイクロ位置決めシステム
研究期間：2018年4月〜2021年3月 総額：1,700千円
Tohoku University Leading Graduate School, Inter-Graduate School Doctoral Degree Program on Science for Global Safety (G-Safety), April 2016 – March 2021. (PI) Project title: Wafer-level vacuum thermo-compression bonding using fly-cut gold. Budget: JPY 1,190,000,-.
国立大学法人 東北大学 リーディング大学院 グローバル安全学リーダー育成プログラム 研究活動費（研究代表者）
課題名：切削平坦化した金バンプを用いたウェハレベル真空封止接合法の開発
研究期間：2016年4月〜2021年3月 総額：1,190千円
Sato Yo International Scholarship Foundation Travel Grant, April 2016 – March 2018. (PI) Project title: Wafer-level vacuum thermo-compression bonding using fly-cut gold. Budget: JPY 300,000,-.
公益財団法人 佐藤陽国際奨学財団 学会出席補助金制度（研究代表者）
課題名：切削平坦化した金バンプを用いたウェハレベル真空封止接合法の開発
研究期間：2016年4月〜2018年3月 総額：300千円