Lei Shu

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NAU-Lincoln Joint Research Center of Intelligent Engineering






I, Lei Shu (舒磊) received the B.Sc. degree in Computer Science from South Central University for Nationalities, China, in 2002 and the M.Sc. degree in Computer Engineering from Kyung Hee University, Korea, in 2005 and the Ph.D. degree in Digital Enterprise Research Institute, from National University of Ireland, Galway, Ireland, in 2010. Until March 2012, I was a Specially Assigned Researcher in Department of Multimedia Engineering, Graduate School of Information Science and Technology, Osaka University, Japan. I am a senior member of IEEE, IEEE IES, IEEE ComSoc, a member of ACM. Currently, I am serving as 1Distinguished Professor, Nanjing Agricultural University, China; 2) Lincoln Professor and Ph.D. Supervisor, the University of Lincoln, UK (link); 3) Director, NAU-Lincoln Joint Research Center of Intelligent Engineering. I am the founder of NAU-Lincoln Joint Research Center of Intelligent Engineering (website). My research interests include: Wireless Sensor Networks, Multimedia Communication, Middleware, Fault Diagnosis, and Security. I have published over 400 papers in related conferences, journals, and books in the area of sensor networks. Currently, my H-index is more than 55 and i10-index is more than 200 in Google Citation (Google Scholar). Total citation of my papers by other people is more than 10000 times. I developed an open source wireless sensor networks simulator ‘NetTopo’ to evaluate & demonstrate my algorithms. NetTopo, has been widely used by international researchers and students. I had been awarded the MASS 2009 IEEE TCs Travel Grant and the Outstanding Leadership Award of EUC 2009 as Publicity Chair, the Globecom 2010, ICC 2013, ComManTel 2014, WICON 2016, and SigTelCom 2017 Best Paper Award, the 2017 IEEE Systems Journal Best Paper Award (2 out of 254), the 2017 Journal of Network and Computer Applications Best Research Paper Award, the 2018 IEEE Systems Journal Best Paper Award (5 out of 598), the 2020 IEEE Systems Journal Best Paper Award (7 out of 793) and Outstanding Service Award of IUCC 2012, ComcomAP 2014, Outstanding Associate Editor Award of 2017, 2018 IEEE Access. I also received a few more awards from Chinese Government as: Top Level Talents in "Sailing Plan" of Guangdong Province, China, Outstanding Young Professor of Guangdong Province, China. I have been serving as associate editors for IEEE Transactions on Industrial Informatics, IEEE Communications Magazine, IEEE Network Magazine, IEEE Systems Journal, IEEE Access, IEEE/CAA Journal of Automatica Sinica, Sensors, etcI also had once served as Editor-in-Chief for EAI Endorsed Transactions on Industrial Networks and Intelligent Systems, an associate editor in these following journals: ACM/Springer Wireless Networks, Transactions on Emerging Telecommunications Technology, Journal of Network and Computer Applications, Security and Communication Networks, Wireless Communications and Mobile Computing, International Journal of Communication Systems, KSII Transaction on Internet and Information Systems, International Journal of Sensor Networks, Ad Hoc & Sensor Wireless Networks, Journal of Internet Technology, Journal of Communications, IET Communications, IET Networks, IET Wireless Sensor Systems,  and served as Guest Editors for IEEE Transactions on Industrial Informatics, IEEE Wireless Communication Magazine, IEEE Communication Magazine,IEEE System Journal, IEEE Sensors Journal, ACM/Springer Mobile Applications and Networks. I am serving as Vice-Chair of IEEE Industrial Electronics Society - TC on Cloud and Wireless Systems for Industrial Applications and Vice-Chair of IEEE Industrial Electronics Society - IEEE Nanjing Chapter, ChinaI served as the Vice-Chair for SIG on Energy Harvesting Communications (Link). I served as more than 50 various Co-Chair for international conferences/workshops, e.g., IWCMC, ICC, ISCC, ICNC, Chinacom, especially Symposium Co-Chair for IWCMC 2012, ICC 2012, General Co-Chair for Chinacom 2014, Qshine 2015, Collaboratecom 2017, Steering and TPC Chair for InisCom 2015; TPC members of more than 150 conferences, e.g., ICDCS, DCOSS, MASS, ICC, Globecom, ICCCN, WCNC, ISCC. I have obtained more than 15 million RMB research grant since October 2012.


 Preferred Email:  lei.shu@ieee.org,  MSN: lei.shu@live.ieGmail & Google Talklei.shu.deri@gmail.com,  Skype: shulei8132.


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