News




JIACO Instruments at ISTFA conference 2018, Oct 28 to Nov 1, Phoenix:
•    Booth 215
See our machine, discuss potential
•    Session: Sample Preparation and Device Deprocessing II (Oct 31, Wednesday): 
     Presenting our latest research on root cause investigations with MIP decapsulation

Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ISTFA)

•    Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
•    Discuss how to handle Ag wire, Cu wire, 3D IC, SiP, WLCSP, automotive package etc. with our novel MIP                           decapsulation technology.
•    Please contact Mark on 
info@jiaco-instruments.com if you would like to meet 
separately (before, during or 
     after ISTFA)

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Details about the presentation of our paper:
Wednesday, October 31st, 2018
12:40 PM
Session Sample Preparation and Device Deprocessing II: 
Preserving Evidence for Root Cause Investigations with Halogen-Free Microwave Induced Plasma Decapsulation

Dr. Charles A. Odegard, SMTSTexas Instruments, Inc.
Mr. Andy Burnett, SMTSTexas Instruments, Inc
Dr. Jiaqi Tang, JIACO Instruments B.V.
, Delft, Netherlands

Ms. Jing Wang, 
JIACO Instruments B.V., Delft, Netherlands



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https://www.tjgreenllc.com/cmse/

JIACO Instruments at CMSE Conference 2018, May 7 to 10, Los Angeles:

     Copper Wirebond Technology Panel Discussion.
•    You can find JIACO Instruments at booth #17 on Wednesday, May 9th and Thursday, May 10th. 
•    Discuss how to handle complex materials (Cu, Ag, High Tg mold compounds) in plastic encapsulated devices for QC
     & FA with our novel MIP decapsulation technology.
•    Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us
      separately (before, during or after CMSE).

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Details about the presentation of our paper:
Session Copper Wirebond Technology Panel Discussion

Dr. Jiaqi Tang, JIACO Instruments B.V.
, Delft, Netherlands

Mr. James McEwen, Oneida Research Services, Inc. 
Ms. Jing Wang, 
JIACO Instruments B.V., Delft, Netherlands
Prof. Dr. Kees Beenakker, Delft University of Technology, Delft, Netherlands



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http://www.cam-workshop.de/

JIACO Instruments at CAM workshop, Apr 25 & 26, Halle, Germany

•    Presenting "Applications of MIP Decapsulation in Device Quality Control and Failure Analysis" in Session 3:                       Sample Preparation at 17:30 on Wednesday, 25.04.2018.
•    Exhibiting at booth #4. 
   Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP 
     decapsulation technology.
•    Speak to JIACO Instruments about your challenging decapsulation requirements.



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http://www.asminternational.org/web/istfa-2017/home

JIACO Instruments at ISTFA conference 2017, 5-9 November, Pasadena:

•    Booth 405
See our machine, discuss potential
•    Session: Sample Preparation and Device Deprocessing (Nov 9, Thursday): 
     Presenting our latest research on System-in-Package (SiP) & Module decapsulation

Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ISTFA)

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Details about the presentation of our paper:
Thursday, November 9th, 2017
11:30 AM
Session Sample Preparation and Device Deprocessing (Ballroom C): 

Dr. Jiaqi Tang, JIACO Instruments B.V.
, Delft, Netherlands

Dr. St. J. Dixon-Warren, PhD, TechInsights Inc., Ottawa, ON, Canada
Ms. Jing Wang, 
JIACO Instruments B.V., Delft, Netherlands
Prof. Dr. Kees Beenakker, Delft University of Technology, Delft, Netherlands



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JIACO Instruments at ESREF conference 2017, 26-27 July, Bordeaux:

•    Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
•    Discuss how to handle Ag wire, Cu wire, 3D IC, SiP, WLCSP, automotive package etc. with our novel MIP                          decapsulation technology.
   Please contact Mark on 
info@jiaco-instruments.com if you would like to meet during.


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JIACO Instruments at IPFA conference 2017, 5-7 July, Chengdu:

•    Booth #4
See our machine, discuss potential
•    Session Sample Preparation, Metrology and Defect Characterization I (July 5, Wednesday): 
     Presenting our latest research on EOS and contamination failure analysis
•    Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP 
     decapsulation technology

Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us     separately (before, during or after IPFA)

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Details about the presentation of our paper:
Wednesday, July 5 , 2017
14:40-15:00pm
Sample Preparation, Metrology and Defect Characterization I: 
Unique Failure Analysis Capabilities Enabled by the MIP Decapsulation Technique
Jiaqi Tang and Jing Wang- JIACO Instruments B.V.
B. Wang, C. Liu – 
Huawei Technologies Co., Ltd.
Prof. Dr. Kees Beenakker – Delft University of Technology


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JIACO Instruments at PSECE conference 2017, 21-23 June, Manila:
 
•    Presenting "State-of-the-art Semiconductor Decapsulation Tool: MIP" at 11:30 at area 1 on Thursday 22th of Jun.
•    Booth #23: See our machine, discuss potential
•    Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP 
     decapsulation technology

Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us     separately (before, during or after PSECE).
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JIACO Instruments at CAM workshop, Apr 26 & 27, Halle, Germany
 
     Wednesday 26th of April.
•    Exhibiting at booth #10. 
•    Speak to JIACO Instruments about your challenging decapsulation requirements
•    Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP 
     decapsulation technology

Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us       separately (before, during or after CAM-Workshop).
 

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    JIACO Instruments at SEMICON China 2017, 14-16 March, Shanghai:
 
      •    Located in Hall W3, booth #3725
      •    Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
      •    Discuss how to handle Ag wire, Cu wire, 3D IC, SiP, WLCSP, automotive package etc. with our novel MIP                                  decapsulation technology.
      •    We speak Chinese and English at SEMICON China.


      Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us               separately (before, during or after SEMICON China).

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JIACO Instruments at ISTFA conference 2016, 6-10 November, Fort Worth:
 
•    Booth 103: See our machine, discuss potential
•    Session Sample Preparation and Device Deprocessing (Monday): 
      Presenting our latest research on Automotive Semiconductor Device Decapsulation

Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ISTFA)

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Details about the presentation of our paper:
Monday, November 7 , 2016
1:00 PM
Session Sample Preparation and Device Deprocessing (Meeting Room 108) 
Dr. Jiaqi Tang JIACO Instruments B.V.
Mr. G. B. Anderson , Infineon Technologies, Livonia, MI
Ms. Jing Wang , JIACO Instruments B.V., Delft, Netherlands
Johannes Bruckmeier , Infineon Technologies Munich, Neubiberg, Germany
Ms. Claudia Keller , Infineon Technologies Munich, Neubiberg, Germany
Genny V. Dela Cruz , Infineon Technologies Singapore, Kallang Sector, Singapore
Prof. Dr. Kees Beenakker , Delft University of Technology, Delft, Netherlands

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MASER Engineering begins operation of advanced decapsulation technology
Enschede, the Netherlands
September 12th, 2016

MASER Engineering begins operation of advanced decapsulation technology Enschede, the Netherlands September 12th, 2016 MASER Engineering and JIACO Instruments are pleased to announce that the JIACO Instruments Microwave Induced Plasma (MIP) decapsulation system is operational and released by MASER Engineering, located in Enschede, The Netherlands. MASER Engineering, with more than 25 years of experience in IC FA, supported JIACO Instruments in the development and beta site testing of the MIP system.
 
JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, high Tg, Chip on Board, BOAC; all without process induced damage for reliable failure analysis and quality control.
 
Prof. Dr. Kees Beenakker, developer of the MIP technology, Dr. Jiaqi Tang, CEO of JIACO Instruments and Mr, Kees Revenberg, Managing Director of MASER Engineering officially released the MIP system at MASER Engineering on September 12, 2016.
 

“Together with MASER Engineering and our mechatronics partner we have successfully developed an advanced decapsulation process to handle the most advanced IC packages for the semiconductor market”, Dr. Jiaqi Tang, CEO of JIACO Instruments commented. “MASER Engineering supported JIACO Instruments during the development of the first prototype with almost 25 year of experience in IC failure analysis. We are pleased with the co-development process and the performance of the MIP system”, Kees Revenberg Managing Director of MASER Engineering acknowledged.
  
MASER Engineering can support customers to perform MIP decapsulation of standard packages and perform decapsulation trails in case of new type of packages (e.g. new type of molding compounds)

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JIACO Instruments at IPFA conference 2016, 18-21 July, Singapore:
 
•    Booth A09: See our machine, discuss potential
•    Session Sample Preparation, Metrology and Defect Characterization II (Thursday): 
      Presenting our latest research on Decapsulation of High Tg Mold Compound 

Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us separately (before, during or after IPFA)

Distributors wanted: We are looking for distributors in Asia. If you believe you have the relevant industry experience and an established customer base, please contact us before IPFA so we can arrange meeting during IPFA.
 
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Details about the presentation of our paper:
Thursday, July.21 , 2016
15:15-16:55pm
Session Sample Preparation, Metrology and Defect Characterization II 
Decapsulation of Copper Wire Devices with High Tg Mold Compound Using Microwave Induced Plasma
Jiaqi Tang and Jing Wang- JIACO Instruments B.V.
T.H. Tan, M. Endo, K.M. Ng and L.C. Lee – Sumitomo Bakelite
Prof. Dr. Kees Beenakker – Delft University of Technology
 
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    JIACO Instruments at SEMICON China 2016, 15-17 March, Shanghai:
 
      •    Located at Booth 4361 with other leading Dutch semiconductor companies.
      •    Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
      •    Discuss how to handle Ag wire, Cu wire, 3D IC, SiP, WLCSP etc. with our novel MIP decapsulation technology.
      •    We speak Chinese and English at SEMICON China.


      Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us                 separately (before, during or after SEMICON China).

      Link to JIACO Instruments SEMICON China exhibitor listing 



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    JIACO Instruments at ISTFA conference 2015, 1-5 November, Portland:
 
      •    Booth 527: See our machine, discuss potential
      •    Session 'Sample Preparation and Device Deprocessing II' (Thursday): Presenting latest research on BOAC device.
      •    Session 'Sample Prep User Group' (Thursday): Panel discussion and application case studies of MIP-O2. 

      Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us                 separately (before, during or after ISTFA).

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Details about the presentation of our paper:
Thursday, November 5, 2015
At 1:25 PM
Session 'Sample Preparation and Device Deprocessing II'
Meeting Room D137 & 138 (Oregon Convention Center )

Decapsulation of Multi-Chip BOAC Devices with Exposed Copper Metallization Using Atmospheric Pressure Microwave Induced Plasma
Jiaqi Tang - JIACO Instruments B.V.
Kristopher D. Staller - Texas Instruments
Kees Beenakker - Delft University of Technology

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JIACO Instruments at ECTC conference 2015, 26-29 May, San Diego:

•    Booth 804: See our machine, discuss potential
•    Session 19 (Thursday):
Presenting our latest reseach on failure analysis in complex 3D stacked die IC’s

Our MIP machine is a breakthrough for failure analysis and quality control in copper wired IC package decapsulation.

Come see for yourself and talk to us about testing your devices on our machine.
Seeing is believing…

Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us separately (before, during or after ECTC).



Details about the presentation of our paper:
Thursday, May 28, 2015
Session 19: 3D Technology: Thermal and Performance Reliability
Committee: Advanced Packaging joint with Applied Reliability
Room: Harbor Island 1

Paper7 at 4:45 PM

Failure Analysis of Complex 3D Stacked-Die IC Packages using Microwave Induced Plasma Afterglow Decapsulation
Jiaqi Tang - JIACO Instruments B.V.
Mitch Curiel - Freescale Semiconductor
Sharon Furcone - Freescale Semiconductor
Ewald Reinders - Maser Engineering
Kees Revenberg - Maser Engineering
Kees Beenakker - Delft University of Technology