Yes I misspelled inventor...
A little bit about my self:
My name is Scott T. Block. I graduated from the University of Illinois Urbana-Champaign with a B.S. in Mechanical Engineering. Worked a little over a year for United Conveyor Corporation, and graduated from Texas Tech University, December 2010, in good old Lubbock, Tx, with a master's degree in Electrical Engineering. As of 22nd of March 2017... I've earned my PhD of Electrical and Computer Engineering from University of California at Davis! Used to work with the Micro power Circuits and Systems group under Dr. Rajeevan and have collaborated heavily with MEMS group. Worked as a contractor with a start up located in Berkeley, CA known as Chirp Micro Systems (it was fun and an awesome experience). In summer of 2015 I slowed a bit down and working as a part timer intern at another startup know as Picosinse. That same summer till Dec. 2016 worked on a DARPA NZERO project. Will start looking carrier soon. Wish me luck, as my journey continues... :D! [MORE]
 NONE SO FAR :)
 Scott T. Block, Xiaonan Jiang, Brad Harris, Can Cui, Jeronimo Segovia Fernandez, Rajeevan Amirtharajah, David A. Horsley, Hooman Rashtian, and Xiaoguang (Leo) Liu "A 100nW CMOS Wake-Up Receiver with -60dBm Sensitivity Using AiN High-Q Piezoelectric Resonators" IEEE ISCAS, Baltimore, Maryland, USA, 28-31 May, 2017 [pdf]
 Ofer Rozen , Scott T. Block , Xuan Mo, Westley Bland, Paul Hurst, Julius M. Tsai, Mike Daneman, Rajeevan Amirtharajah, and David A. Horsley, "Monolithic MEMS-CMOS Ultrasonic Rangefinder Based on Dual-Electrode PMUTs" 29th IEEE Conference on Micro Electro Mechanical Systems Conference, Shanghai China, 24-28 January, 2016 [link][pdf]
 Ofer Rozen , Scott T. Block , Stefon E. Shelton , David A. Horsley, "Piezoelectric Micromachined Ultrasonic Transducer With Increased Output Pressure via Concentric Venting Rings," 18th International Conference on Solid-Sate Sensors, Actuators, and Microsystems, Anchorage, Alaska, 21-25 June 2015 [link][pdf]
 Ofer Rozen, Scott T. Block, Stefon E. Shelton, Richard J. Przybyla, David A. Horsley, "Air-Coupled Aluminum Nitride Piezolectric Micromachined Ultrasonic Transducers at 0.3MHz to 0.9MHz," 28th IEEE Conference on Micro Electro Mechanical Systems Conference, Portugal, 18-22 Jan. 2015 [link][pdf]
 Yiran, Li, Scott T. Block, Li Lu, Changzhi Li, "All-CMOS Low Voltage Temperature Sensor Front-End and Bandgap Circuit Using Bulk-Driven Technology, "Semiconductor Research Corporation (SRC) Tech Conference, Austin, Tx, Sep. 2011 [pdf]
 Li Lu, Scott T. Block, David E. Duarte, Changzhi Li, “A 0.45-V MOSFETs-Based Temperature Sensor Front-End in 90 nm CMOS With a Noncalibrated ±3.5°C 3σ Relative Inaccuracy From -55°C to 105°C,” Circuits and Systems II: Express Briefs, IEEE Transactions on, vol. 60, no. 11, pp. 771-775 Nov. 2013 [pdf][IEEE]
 Yiran Li, Li Lu, Scott T. Block, Changzhi Li, "Temperature Characteristics of Schottky Barrier Diodes for Low-Voltage Sensing Applications," IET Electronics Letters, Volume 48, Issue 7, p.406-408, 29 March 2012 [pdf][IET][IEEE].
 Scott T. Block, Ofer Rozen, Westley Bland, Paul Hurst, David Horsley, Rajeevan Amirtharajah, "Monolithic MEMS Ultrasonic Time-of-Flight Rangefinder with Gain Clip-Detect in 180nm CMOS," reworked and attempted submitted for VLSI Symposia 2016 25th of Feb. 2016, not accepted [pdf]
 Scott T. Block, Ofer Rozen, Westley Bland, Paul Hurst, David Horsley, Rajeevan Amirtharajah, "Monolithic MEMS Ultrasonic Time-of-Flight Rangefinder with Gain Clip-Detect in 180nm CMOS," attempted ISSCC 2016, not accepted [text][figs]
 Current PhD students in MCSG: From left to right Andrew Chang, Erin Fong, Khadar Shaik, and Scott T. Block @ industrial affiliates day 25th of April 2014
Works in Progress:
 ACTIVELY working on. NZERO project. This a DARPA project where we are basically making a extremely low power trip sensor. So actually involves some of the low power logic that I first looked into during the start of my PhD. Don't really have too many cool videos... tones of slides and folders and tapes outs... TI 180nm, InvenSense 180nm, and IBM 130nm... yeah crazy I know...
InvenSense CMOS only wire bonded to a MEMS Mic
 Taking a back seat. so a while back I did some work with MEMS ultrasonic transducers. Since none of my attempts got published I've decided to share all the videos I made during that time... InvenSense 180nm process
 Currently Revisiting. Researching, designing, simulating, and building novel MEMS DC-to-DC converters. Currently experimenting with MEMS relays built at UCBerkeley. Dr. Alon's group [link] has been very helpful thanks to Matt [link]. I'm hoping to get relays soon from XCOM [link]... fabrication delays... they have been made as can be seen in the images bellow... but need to install AutoCad and pick a package for...
Also fabricated a thyristor test chip in TI 180nm process in conjunction with my relay work.
 Currently on the back burner. Looking at the possibility of harvesting energy from electrostatic discharge (ESD) at the printed circuit board, microelectromechanical system, and IC levels. Designing serval different passive and active possible methods and currently in the setup phase of my test bench for future circuit testing.
 Indirectly looking back at with NZERO project. Looking into designing (Ultra-Low Voltage) Sub-Threshold Logic family... (some simulation, learning, and literature review).
Unfinished or Retired projects:
 No longer being pursued at this time... Scott T. Block, Yiran Li, Changzhi Li, Semi-configurable temperature sensor using Shottky diode array. The fabricated chip in IBM 90nm process should be arriving Nov-Dec 2011.
 No longer being pursued at this time... Scott T. Block, Yiran Li, Changzhi Li, Semi-configurable temperature sensor using Schottky diode array. The fabricated chip in AMI 0.5um process has arrived August 2011 (see image below) [pdf].
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Last updated: 2013.10.29.10