Facilities

INESC Microsystems and Nanotechnologies operates a 250 m2 cleanroom (class 100 and class 10 areas) and adjoining 250 m2 grey area (nominally class 10,000) for magnetic recording head and MR sensor fabrication, thin film semiconductor device, biosensor and lab-on-chip fabrication including microfluidics, and MEMS processing.


Materials optimization and thin film deposition
  • Nordiko 3000 - ion beam deposition and milling - 6 inch wafer processing, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, Pt, MgO, AlOx, Al, Au, Ti)
  • Nordiko 3600 - ion beam deposition and milling - 8 inch wafer, 6 targets (e.g. Ta, Ru, MnIr, MnPt, NiFe, CoFe, CoFeB, MgO, AlOx, Al, NiFeCr)
  • N2000 - magnetron and RF sputtering
  • N7000 - magnetron  sputtering - 6 inch wafer processing, 
  • UHVI - magnetron  sputtering - 6 inch wafer processing, 1 target (mosaic CoZrNb)
  • UHVII- RF  sputtering - 6 inch wafer processing, 1 target (Al2O3)
  • Alcatel - SiO2, Cr, Al, ITO, IZO, AZO, GeSbTe, Si, Ti, Ni
  • GeSiM Nano-Plotter NP2.1 (installed July 2009)
  • Plasma enhanced chemical vapor deposition systems (2)
  • Diffusion/passivation furnaces
  • Aixtron NanoInstruments Black Magic: 2-inch Plasma Enhanced Chemical Vapour Deposition system for graphene and nanotube growth, with methane, acetylene, hydrogen, ammonia, nitrogen and argon gas supply.

Device Fabrication
  • Class 10 lithography area
  • Class 100 cleanroom area
  • Spin coating
  • Processing of soft lithographic techniques (SU8, PDMS) for microfluidics
  • Heidelberg DWLii direct write laser lithography 
  • RAITH 150 electron beam lithograph 
  • Reactive ion etching systems
  • Ion-beam milling system
  • Dicing saw
  • Automated lapping tool


Device and Film Characterization
  • Hitachi Scanning Electron microscope
  • Olympus optical microscope
  • Dektak profilometer
  • Rudolf ellipsometer
  • Vibrating Sample magnetometer
  • Optoelectronic characterizations
  • Optical detection of electromechanical deflection (in air and vacuum)
  • Magnetoresistance measurement setups
    • 150 Oe
    • 2KOe
    • Auto prober set up for 6inch wafer
  • X-ray diffractometer
  • Fluorescence microscope