Dr. Abhijit Kar (Scientific Officer): Group Leader from JBNSTS
Dr. Riddhi Majumder (Asst. Prof.): Collaborating Partner from St. Xavier's College
Ms. Monalisa CharPhD Student
Ms. Rasmi Das- Graduate Research Scholar
Ms. Harshita KaulUndergraduate scholar
Ms. Sampurna MukherjeeUndergraduate Scholar
Ms. Debosruti BoralUndergraduate Scholar
Ms. Soumi Mukherjee- Undergraduate Scholar
Ms. Abhinanda Kar- Undergraduate Scholar
Ms. Indrakshi Dutta- Undergraduate Scholar

  • Ph.D (Doctor of Philosophy): Jadavpur University, Kolkata,India, Chemistry and Materials Science (In CSIR-NML)


  •  Since, 2010, Scientific Officer (Asst. Prof.), J B Centre of Excellence; Jagadis Bose National Science Talent Search (JBNSTS), (An Autonomous Institute, Promoted by  
    Department of Higher Education, Govt. of West Bengal, and recognized by Dept. of Scientific & Industrial Research, Govt. of India.) 
  • Previously associated with  NThU, Taiwan, as  Post Doctoral Researcher
  • 2009-  2010: EMPA-Swiss Federal Research Institute (ETH-Domain), Switzerland, Post Doctoral Researcher.
  • 2009- Interdisciplinary Centre for Advanced Materials Simulation  Rühr Universität, Bochum, GermanyVisiting Scientist,
  • 2008- 2009: Sungkyunkwan University, South Korea, Seoul, Post Doctoral Research (Faculty)
  • 2008- National Metallurgical Laboratory (CSIR), India, Scientist Fellow (Post Doctoral Research)
  • 2004- South Point High School, Senior Section, Kolkata, Chemistry Teacher.

  • Senior Research Fellowship Award (CSIR), India, 2008
  • Scientist Fellow by NML-CSIR, India, 2008
  • National Scholarship Award, India, 1995
  • 1st prize for best Poster presentation by Indian Ceramic Society-2008
  • Most distinguished person honoured by Marquis Who’s Who in the world-2008
  • Ranked among the top 3 students of the University in the M.Sc (Chem.) examination.2004
  • Served as National Observer for National Science Talent Search (NSTS) Examination 2004.
  • Regular Reviewer Board Member of different Peer Reviewed International Journals.
  • Visiting Scientist for EU collaborative research between Germany, Switzerland, 2009
  • Editorial Board Member of Journal of Energy and Natural Resources , by Science Publishing Group Journals, 2013
  • Editorial Board Member of Journal of Materials Sciences and Applications ; by American Association for Science and Technology, 2014
  • Young Scientist Project Award by Department of Science & Technology(DST), Govt. Of India,twice in 2008 and 2013


Current research interest comprises of  :

  • Application of nanotechnology for Micro-electronics, Nanostructured composites and energy devices, Photo voltaics.
  • Thin film and Nanomultilayer structure for advanced materials joining
  • Different Advanced Materials Joining Techniques: BGA, Flip Chip, Ultrasonic Bonding, Ceramics joining(Brazing), FSW
  • Interface and its structure property relationships
  • Different materials Characterization techniques e.g: SEM, TEM, XRD, surface – interface analysis, EPMA & Mechanical property evaluation
  • Microstructural modeling and simulation for the structure property correlation of  solid-solid/ solid-liquid interface
  • Thermodynamic modeling using Thermocalc, DICTRA and Phase field Modeling using MICRESS
  • Bio-compatible and biodegradable composite materials with high mechanical properties for structural & biomedical application
  •  Non-destructive evaluation of the interface and materials

Development and reliability of the use of nanostructured lead free solder and soldering technique for electronic and microelectronics applications

DST Govt. Of India

As PI,

(2013) For 3 years


Cost effective synthesis of graphene and metal-incorporated graphene:  their application as sensors of environmental gases

DIT- Govt. of India

As Co-PI

(2013); Multi Institutional Project ;For 3 years


Understanding the mechanism of action of Homeopathic medicine at the molecular level in Nano Domains in-vivo and in-vitro systems CCRH

Govt. Of India

 As Co-PI

(2015); Multi Institutional Project ;For 3 years


Training of motivated teachers in innovative methods of science teaching to build scientific aptitude among school students of districts of West Bengal

 DST- Govt. of India As PI
2016 for 2 years

Research Scholar : working for their PhD (2)
Undergraduate Research Scholars (11)


List of Publications (38+1)
Int. Journal: 21,
Conf. Proceedings:17
Book Chapter: 01
Invited Lectures:12
h-Index: 10 (https://scholar.google.co.in/citations?user=jyrLZNYAAAAJ&hl=en&oi=ao)


Corresponding Author- Marked in the list from Scopus
  1.  KAR, A., RAY, A.K., 2014. Synthesis of nano-spherical nickel by templating hibiscus flower petals. American Journal of Nanoscience and Nanotechnology (NANO), 2(2), pp.17-20
  2. BUI, Q.V., NAM, N.D., CHOI, D.H., LEE, J.B., LEE, C.Y., KAR, A., KIM, J.G. and JUNG, S.B., 2010. Corrosion protection of ENIG surface finishing using electrochemical methods. Materials Research Bulletin, 45(3), pp. 305-308.
  3. BUI, Q.V., NAM, N.D., NOH, B.-., KAR, A., KIM, J.-. and JUNG, S.-., 2010. Effect of Ag addition on the corrosion properties of Sn-based solder alloys. Materials and Corrosion, 61(1), pp. 30-33.
  4.  BUI, Q.V., NAM, N.D., YOON, J.W., CHOI, D.H., KAR, A., KIM, J.G. and JUNG, S.B., 2011. Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish. Journal of Electronic Materials, 40(9), pp. 1937-1942.
  5. GHOSH, M., GUNJAN, M.K., DAS, S.K., KAR, A., GHOSH, R.N. and RAY, A.K., 2010. Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: A comparative study. Materials Science and Technology, 26(5), pp. 610-614.
  6. GHOSH, M., KAR, A., DAS, S.K. and RAY, A.K., 2009. Aging characteristics of Sn-Ag eutectic solder alloy with the addition of Cu, In, and Mn. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 40(10), pp. 2369-2376.
  7. GHOSH, M., KAR, A., KUMAR, K. and KAILAS, S.V., 2012. Structural characterisation of reaction zone for friction stir welded aluminium-stainless steel joint. Materials Technology, 27(2), pp. 169-172.
  8. KAR, A.*, CHAUDHURI, S., SEN, P.K. and RAY, A.K., 2007. Evaluation of hardness of the interfacial reaction products at the alumina-stainless steel brazed interface by modeling of nanoindentation results. Scripta Materialia, 57(9), pp. 881-884.
  9. KAR, A*., GHOSH, M., GHOSH, R.N., MAJUMDAR, B.S. and RAY, A.K., 2008. Evolution of mechanical and electrical properties of tin-lead and lead free solder to copper joint interface. Materials Letters, 62(1), pp. 151-154.
  10. KAR, A*., GHOSH, M., MAJUMDAR, B.S., GHOSH, R.N. and RAY, A.K., 2007. Interfacial microstructure, shear strength and electrical conductivity of Sn-3·5Ag-0·5In/Cu lead free soldered joints. Materials Technology, 22(3), pp. 161-165.
  11. KAR, A*., GHOSH, M., RAY, A.K. and GHOSH, R.N., 2007. Effect of copper addition on the microstructure and mechanical properties of lead free solder alloy. Materials Science and Engineering A, 459(1-2), pp. 69-74.
  12. KAR, A.*, GHOSH, M., RAY, A.K. and RAY, A.K., 2008. Effect of interfacial thickness and residual stress on the mechanical property of the alumina-stainless steel braze joint interface. Materials Science and Engineering A, 498(1-2), pp. 283-288.
  13. KAR, A*., MANDAL, S., GHOSH, R.N., GHOSH, T.K. and RAY, A.K., 2007. Role of Ti diffusion on the formation of phases in the Al 2O 3-Al 2O 3 brazed interface. Journal of Materials Science, 42(14), pp. 5556-5561.
  14. KAR, A., MANDAL, S., RATHOD, S. and RAY, A.K., 2006. Effect of Ti diffusivity on the formation of phases in the interface of alumina-alumina brazed with 97(Ag40Cu)3Ti filler alloy, Proceedings of the 3rd International Brazing and Soldering Conference 2006, pp. 219-225.
  15. KAR, A*., MANDAL, S., VENKATESWARLU, K. and RAY, A.K., 2007. Characterization of interface of Al 2O 3-304 stainless steel braze joint. Materials Characterization, 58(6), pp. 555-562.
  16. KAR, A*. and RAY, A.K., 2007. Characterization of Al 2O 3-304 stainless steel braze joint interface. Materials Letters, 61(14-15), pp. 2982-2985.
  17. KAR, A.*, SAGAR, S.P. and RAY, A.K., 2007. Characterization of the ceramic-metal brazed interface using ultrasonic technique. Materials Letters, 61(19-20), pp. 4169-4172.
  18. RAY, A.K., GOSWAMI, B., KAR, A., RAY, A.K., DAS, H.K., ROY, P.K., KUMAR, S.B. and BOSE, S.C., 2008. Damage resistance of a thermal barrier coated superalloy for combustor liners in aero turbines during fatigue and creep. Canadian Metallurgical Quarterly, 47(4), pp. 479-494.
  19. RAY, A.K., KAR, A., KORI, S.A., PATHAK, L.C. and SONNAD, A.N., 2012. Graphite-to-304SS Braze Joining by Active Metal-Brazing Technique: Improvement of Mechanical Properties. Journal of Materials Engineering and Performance,, pp. 1-9.
  20. RAY, A.K., ROY, N., KAR, A., RAY, A.K., BOSE, S.C., DAS, G., SAHU, J.K., DAS, D.K., VENKATARAMAN, B. and JOSHI, S.V., 2009. Mechanical property and characterization of a NiCoCrAlY type metallic bond coat used in turbine blade. Materials Science and Engineering A, 505(1-2), pp. 96-104.
  21. SINHA, A., NAYAR, S., KAR, A., GUNJAN, M.K., MAHATO, B., DAS, G., KUMAR, A. and CHABRA, A., 2008. Microhydrogel-mediated synthesis of sintered hydroxyapatite granules. International Journal of Applied Ceramic Technology, 5(5), pp. 458-463.




1. Ceramic-Metal Joining Using Active Filler Alloy-An In-Depth Electron Microscopic Study Abhijit Kar* and Ajoy Kumar Ray; Chapter 18, The Transmission Electron  
    Microscope, Edited by Dr. Khan Maaz, ISBN: 978-953-51-0450-6,

2. Nanoelectronics and Materials Development, Book Edited by Dr. Abhijit Kar, Published by InTech Publisher,ISBN 978-953-51-4734-3



1.    Abhijit Kar*, Sudipta Mandal, K. Vekateswarlu and Ajoy Kumar Ray; “Characterization of ceramic-metal interface brazed with 97(Ag28Cu) 3Ti active filler alloy”; 
       Proceedings of International Conference on Advances in Materials and Materials Processing (ICAMMP-2006), 3-5 Feb, IIT-Kharagpur.
2.    Abhijit Kar*, Sudipta Mondal, Shrinivas Rathod, and Ajoy Kumar Ray: Effect of Ti diffusivity on the formation of phases in the interface of alumina-alumina    

       with 97(Ag40Cu)3Ti filler alloy; Proceedings of 3rd International Brazing and Soldering Conference (IBSC), 23-26 April, 2006, San Antonio, Texas, USA; pp219-224.
3.    Abhijit Kar*, K. Venkateswarlu, R.N. Ghosh and Ajoy Kumar Ray; “Determination of joint strength of alumina-stainless steel brazed with Ag-Cu-Ti active filler alloy”; 
       Proceedings of 59th NMD-ATM 14-16 Nov, 2006, Jamshedpur, India. 
4.    Abhijit Kar*, Mainak Ghosh, Rabindra Nath Ghosh and Ajoy Kumar Ray; “Comparative Study of Tin Lead and Lead Free Solder Joint Interface”; Proceedings of the 
       International conference on Recent Advances on Composite Materials (ICRACM-2007), February 20-23,2007, New Delhi, India.
5.    Abhijit Kar*, Mainak Ghosh, Bhaskar .S. Majumder, Rabindra Nath Ghosh, Ajoy Kumar Ray; Carbon nanotube reinforced lead free solder-Cu interface Characterization; 
       Proceedings of the National Seminar on Smart Electroceramics (NCSE-2007), 8-9March, 2007 LULU international Convention Centre, Trissure, India, organized by 
       C-MET Trissure.
6.    Ajoy Kumar Ray and Abhijit Kar;Joining:As Cutting  Edge Technology for using Dissimilar Materials in Combination”,Invited Lecture at National Workshop on
       Machining & Machinability of Advanced Materials,
29-30th March 2007, CMERI- Durgapur; India.
7.    Ajoy Kumar Ray, Abhijit Kar and Mainak Ghosh; “Microstructural characterization of tin lead and lead free solder joint interface”, Proceedings of the 
       International Symposium on Advanced Materials and Processing (ISAMP-2007), 29-30 October 2007, Bagolkot. Karnataka, India.
8.    Ajoy Kumar Ray, K. Venkateswarlu, Sarmistha Palit Sagar and Abhijit Kar*; “Structure property correlation of the metal-ceramic braze joint”;
       Proceedings of the 71 Annunal session of the IndianCeramic Society (71 InCers), 9-11 January, 2008, Bangalore, India.
9.    Abhijit Kar*, Mainak Ghosh, Ajoy Kumar Ray; “Influence of microstructure on the mechanical property of the Pb-free solder to copper joint interface”; 
       37th National Seminar on Crystallography, Jadavpur University, 6-8 February, 2008.
10.  Abhijit Kar*, Mainak Ghosh, Sarmistha Palit Sagar, Ajoy Kumar Ray; “Dissimilar materials joining: Near net shaped ceramic-metal couple to eco-friendly lead 
       free electronic interconnects”; Young Scientist Colloquium 2008; MRSI, Kolkata Chapter; Jadavpur University; 25th July, 2008.
11.  Ajoy Kumar Ray, Mainak Ghosh, Abhijit Kar*; “Lead free joining in electronic and packaging industries”; 4th International Brazing & Soldering Conference 
       (IBSC); ASM International, USA, April 26-29, 2012.
12.  A.K. Ray, Abhijit Kar, S. A. Kori, L. C.Pathak,  A. Sonnad, An innovative approach to improve the mechanical property of the graphite to 304SS braze joint by active 
       metal brazing technique”, National Symposium on Advanced Ceramics & Composites, Centre for Excellence, Jamshedpur, India, 7-8 May 2009,
13.  Abhijit Kar* , Ajoy Kumar Ray, Mainak Ghosh, Seung Boo Jung; “Interfacial changes with the aging of Lead free solder to copper joint interconnects used in electronic 
       and packaging industries”; 6th International Conference on High Temperature Capillarity; Athens 6-9 May 2009.
      Microbial property of silver nanoparticles synthesized by green technology; Proceedings of Frontiers of Microbiology : Prospects and Challenges, UGC Sponsored        
      National Seminar
at RKM-Belur, 20-21 November, 2014.
      nanoparticle on both gram positive & gram negative micro-organisms; Proceedings of the First International Conference on Emerging Materials Characterization and
      Application (EMCA-2014),
at Kolkata, 4-6 December 2014.
16. ARNAB BANERJEE, SUKHEN DAS, ABHIJIT KAR; Reliability analysis of the lead free solder to copper joint interface; Proceedings of the First International
      Conference on Emerging Materials Characterization and Application (EMCA-2014)
, at Kolkata, 4-6 December 2014.
      nanoparticles synthesized by green technology on microbes;  An Interdisciplinary Approach to Biological Science (IABS-2015), at IACS-Kolkata, 2-3 February,


Abhijit Kar,
Jan 14, 2015, 1:12 AM