I am currently a graduate student at Rensselaer Polytechnic Institute (RPI) in Department of Material Science and Engineering. Prior to that, I did my B. Tech in Ceramic Engineering from Institute of Technology, Banaras Hindu University (IT-BHU).
For my thesis, I have been working on understanding the effect of dopants and interfaces on transport properties (electrical and thermal conductivity) of semiconductor bulk and thin film materials. I also studied metal-semiconductor interfaces and tailored them for improving efficiency of thermoelectric devices made from semiconductor materials. At Intel, I worked on various projects to find thermal solutions for next generation Intel processors like a graphene-polymer composite for improved thermal conductivity and understanding the failure mechanism of metal-solder interface in processor assembly. Work done at Intel led to two publications and one patent has been submitted. At MPI, I worked on understanding the effect of dopant on nanoscale devices made from semiconductor material by studying transport properties at cryogenic temperatures. I also have extensive experience in various materials characterization tools like SEM-EDX, TEM, XPS, XRD, FTIR, SIMS, Raman and RBS, and data analysis.
Research interest includes:
Semiconductor and 2D materials