Deposition Techniques


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         The main techniques used for thin film deposition are spin casting, Langmuir-Blodgett deposition, and (for metal electrodes on device structures) thermal evaporation. Each of these methods have their own advantages and disadvantages, the most prominent of which are listed below.

Click on the technique name for a description of the method.

 

Spin Coating films

Langmuir-Blodgett (LB) films

Layer-by-Layer (LbL) Self assembly

Description

Thin films are deposited direct from solution by placing a few drops on a rapidly rotating substrate.

Thin films are deposited layer by layer by passing the substrate through a floating monolayer.

Films are deposited by electrostatic interactions between anionic and cationic compounds.

Advantages

Quick and easy, highly repeatable films. Works for nearly all organic materials.

Molecular control over film thickness, highly ordered molecular structures.

Deposition on almost any solvent accessible surface

Disadvantages

No control over molecular-scale structure.

Slow deposition. Not all materials are suitable for LB deposition.

Slow. Not suitable for neutral molecule.