Alexander Coucoulas, A.M. Benzoni, M.F. Dautartas, R. Dutta, W.R. Holland, C.R. Nijander, R.E. Woods

AT&T Bell Labs., Princeton, NJ

Conference Proceeding: 07/1993; DOI:10.1109/ECTC.1993.346803ISBN: 0-7803-0794-1In proceeding of: Electronic Components and Technology Conference, 1993. Proceedings., 43rd

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alexander coucoulas, 
Jul 17, 2012 9:39 AM

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With the increased use of photonic packages, there are needs for
reliable and low cost methods of attaching optical components. Packages
based on silicon optical bench (SiOB) technology include oxide coated
ball-lenses and silica fibers which are generally epoxied in
anisotropically etched features of silicon substrates. The reliable
attachment of these micro-optical components requires the application of
small (approximately 1 nanoliter) quantities of epoxy at precise
locations on the substrate. This is a time consuming process and
requires considerable operator training and skill. Dispensing too much
epoxy can deteriorate the optical performance of the device and
dispensing too little results in an insufficient holding power. AlO
bonding is an alternative attachment technique, under development, which
forms solid-state bonds directly between these oxide-components and
aluminum thin film coated silicon optical bench substrates and therefore
does not require the handling of additives, such as epoxy, at the bond
interface. This paper includes: methods of bonding ball-lenses and
fibers; an interfacial analysis and proposed bonding mechanism derived
from SEM/metallographic photomicrographs and thermodynamic data;
destructive test results as a function of bonding and material
parameters and; in situ loss measurements through AlO bonded components
(multi-, single mode fibers and ball-lenses) during the bonding
procedures and subsequent thermal cycling (-40 to 80°C and from
ambient to -195.8°C) tests