Technical Program Committee

- Rafael Accorsi, University of Freiburg, Germany
 
- Mahdi Alavi, University of Windsor, Canada
 
- Florina Almenarez, University Carlos III of Madrid, Spain
 
- Fengye Bao, Virginia Tech, USA
 
- Mark Bartlett, University of York, UK
 
- Iain Bate, University of York, UK
 
- Moris Behnam, Mälardalen University, Sweden
 
- Abdeltouab Belbekkouche, University of Montreal, Canada
 
- Paolo Bellavista, Università di Bologna, Italy
 
- Achim D. Brucker, SAP Research, Germany
 
- Carlos Tavares Calafate, Technical University of Valencia, Spain
 
- Celeste Campo, University Carlos III de Madrid, Spain
 
- Juan-Carlos Cano, Universidad Politécnica de Valencia, Spain
 
- Li-Pin Chang, National Chiao-Tung University, Taiwan
 
- Yuan-Hao Chang, National Taipei University of Technology, Taiwan
 
- Chong Chen, Samsung Electronics Inc, USA
 
- Liquan Chen, Southeast University, China
 
- Qian Chen, Institute for Infocomm Research (I2R), Singapore
 
- Yashu Chen, National Taiwan University of Science and Technology, Taiwan
 
- Albert Cheng, University of Houston, USA
 
- Fred Cheng, TChips Technologies, USA
 
- Marco Chiarandini, University of Southern Denmark, Denmark
 
- Seongje Cho, Dankook University, Korea
 
- Yoojin Chung, Hankuk University of Foreign Studies, Korea
 
- Alessandro Colantonio, Università di Roma Tre, Italy
 
- Liliana Cucu-Grosjean, INRIA, France
 
- Michel Cukier, University of Maryland at College Park, USA
 
- Mehrdad Dianati, Surrey University, UK
 
- Qinghe Du, Xian Jiaotong University, China
 
- Weiwei Fang, Beijing Jiaotong University, China
 
- Pasi Fränti, University of Eastern Finland, Finland
 
- Piedad Garrido, EUPT- University of Zaragoza, Spain
 
- Michael Grottke, University of Erlangen-Nurember, Germany
 
- Enrique Hernández-Orallo, Universidad Politécnica de Valencia, Spain
 
- Kun Hua, Lawrence Technology University, USA
 
- Yu Hua, Huazhong University of Science and Technology, China
 
- Brigitte Jaumard, Concordia University, Canada
 
- Jinman Jung, Seoul National University, Korea
 
- Bongjae Kim, Seoul National University, Korea
 
- Dongkyun Kim, Kyungpook National University, Korea
 
- Pankoo Kim, Chosun University, Korea
 
- Sang-Wook Kim, Hanyang University, Korea
 
- Yeongkwun Kim, Western Illinois University, USA
 
- Mohammad Komareji, Singapore University of Technology and Design, Singapore
 
- Israel Koren, University of Massachusetts, USA
 
- Ibrahim Korpeoglu, Bilkent University, Turkey
 
- Kelvin Lau, Universiti Malaysia Sabah, Malaysia
 
- Junghoon Lee, Jeju National University, Korea
 
- Chenglin Li, Shanghai Jiaotong University, China
 
- Sunho Lim, Texas Tech University, USA
 
- Dan Lo, Southern Polytechnic State University, USA
 
- Flavio Lombardi, University of Rome, Italy
 
- Francisco J. Martinez, University of Zaragoza, Spain
 
- Eric Matson, Purdue University, USA
 
- Hamid Mcheick, Universite du Quebec a Chicoutimi, Canada
 
- Lusheng Miao, Tshwane University of Technology, South Africa
 
- Hong Min, Hoseo University, Korea
 
- Hamed Mojallali, University of Guilan, Iran
 
- Nicolas Navet, University of Luxembourg, Luxembourg
 
- Thomas Nolte, Mälardalen University, Sweden
 
- Shuping Peng, University of Bristol, UK
 
- Roberto Di Pietro, University of Rome, Italy
 
- Sasikumar Punnekkat, Mälardalen University, Sweden
 
- Paul Scheunders, University of Antwerp, Belgium
 
- Gaotao Shi, Tian Jin University, China
 
- Abdullatif Shikfa, Alcatel-Lucent Bell Labs, France
 
- Lei Shu, Guangdong University of Petrochemical Technology, China
 
- Agusti Solanas, Rovira i Virgili University, Spain
 
- Thomas Stocker, University of Freiburg, Germany
 
- Juan E. Tapiador, Universidad Carlos III de Madrid, Spain
 
- Anatoli Torokhti, University of South Australia, Australia
 
- Anthony Tsetse, State University of New York, USA
 
- Honggang Wang, University of Massachusetts Dartmouth, USA
 
- Xinheng Wang, Swansea University, UK
 
- Mohammed Watfa, University of Wollongong in Dubai, United Arab Emirates
 
- Dalei Wu, Massachusetts Institute of Technology, USA
 
- Mingwei Wu, Zhejiang University of Science and Technology, China
 
- Shaoen Wu, University of Southern Mississippi, USA
 
- Feng Xia, Dalian University of Technology, China
 
- Kuai Xu, Arizona State University, USA
 
- Ming Yang, Southern Polytechnic State University, USA
 
- Qing Yang, Montana State University, USA
 
- Sai Zhang, University of Washington, USA
 
- Fang Zhao, Research Laboratory of Electronics, MIT, USA
 
- Yanxiao Zhao, South Dakota School of Mines and Technology, USA
 
- Jingyu Zhou, Shanghai Jiao Tong University, China
 
- Liang Zhou, Nanjing University of Posts and Telecommunications, China