Analytical Services

Primary Services

  • Electrical Failure Analysis
  • Metallurgical Failure Analysis
  • Hot Spot Detection
  • Emission Microscopy
  • Voltage Contrast
  • Latchup Evaluation
  • Dielectric Integrity Tests
  • Decoration Techniques
  • Optical Microscopy
  • Optical Beam Induced Current (OBIC)
  • Scanning Electron Microscopy (SEM)
  • Circuit Extraction
  • X-ray Radiography
  • Package Decapsulation
  • Sequential Stripback
  • Destructive Physical Analysis (DPA)
  • Sub-Micron Cross-Section
  • Parallel and Angle Lapping
  • Structure Characterization
  • Fiberoptic Component Characterization
  • Solid State Laser Characterization
  • Micro-Electromechanical Systems (MEMS) Characterization
  • X-ray Energy Dispersive Spectroscopy (XED)
  • Auger Electron Spectroscopy (AES)
  • MIL-STD Certifications