李泓緯
Hung-Wei Li

Photonics Integrated Circuits Process R&D engineer

Lightium, Zurich, Switzerland

關於我：

PhD in Microsystems and Microelectronics and R&D Engineer at a photonic integrated circuit (PIC) startup in Zurich. I work at the intersection of materials science, semiconductor device physics, and electrochemistry, with a focus on translating advanced research into robust, manufacturable device technologies.

During my PhD at EPFL, I led CMOS-compatible ferroelectric and antiferroelectric device development from concept to measured prototypes, including multilayer FE/AFE capacitors and 2D ferroelectric FETs (FeFETs) for energy-efficient memory and neuromorphic computing.

Today, at the front line of PIC R&D, I connect emerging research trends with real manufacturing and market needs, bridging process integration, characterization, and prototype validation to accelerate technology transfer.

Core strengths

Thin-film and 2D device fabrication, process development, and end-to-end experimental execution
Materials and electrical characterization, including electrochemical analysis for performance insight
FeFET and AFeFET architecture design for multifunctional memory, logic-in-memory, and neuromorphic hardware
Clear scientific communication, data-driven decision making, and structured project management
Cross-functional collaboration across academia and industry to deliver measurable results

I’m passionate about sustainable, energy-efficient hardware, leveraging ferroelectric and 2D-material devices to enable computing beyond conventional CMOS scaling.