學術著作

期刊論文 (Journal)

1. C. -C. Lee, Meng-Kai Shih, Zi-An Huang, Yao-Jun Tsai, Ming-Hsien Wu, Ching-Ya Yeh, Kevin Dao and Yung-Yu Hsu, "Fabrication-Induced Warpage Characterization Analysis of Micro LED Fan-Out Packaging," in IEEE Transactions on Components, Packaging and Manufacturing Technology, Jan. 2025. （IF=2.3, SCI）

2. Meng-Kai Shih, T. -Y. Chen, B. -Y. Huang, C. -T. Pan, C. -C. Wang and C. P. Hung, "Thermal Characteristics Analysis and Optimization of Heterogeneous 2.5-D Package Under System-Level Conditions," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 1, pp. 157-164, Jan. 2025. （IF=2.3, SCI）

3. Meng-Kai Shih, Shi-Jil Chen, I. Hung Lin, Bai‑Yao Lou, and Tom Ni, "Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan‑Out Packages," Journal of Electronic Materials, https://doi.org/10.1007/s11664-024-11420-2 (12 pages), Oct. 2024. （IF=2.2, SCI）

4. Meng-Kai Shih, Guan-Sian Lin, Jonny Yang, "Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging," J. Electron. Packag. ASME, 146(3): 031002 (13 pages), Sep. 2024. （IF=2.2, SCI）

5. Shih, MK., Liu, YH., Lin, GS. et al. Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages. Exp Tech (2023). https://doi.org/10.1007/s40799-023-00679-5（IF=1.6, SCI）

6. Meng-Kai Shih ,Yu-Hao Liu ,Calvin Lee and C. P. Hung, “Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions,” Materials, 16(12), 4291, June 2023（IF=3.748, SCI）

7. Meng-Kai Shih, Nan-Yi Wu, Wei-Hong Lai, Tang-Yuan Chen, Chin-Li Kao, C. P. Hung, “Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules,”  IEEE Transactions on Electron Devices , v 70, issue 1, p 215-221, Jan. 2023（IF=3.221, SCI）

8. Han-Wen Hu, Yu-wei Huang, Yi-Chieh Tsai, Meng-Kai Shih, Kuan-Neng Chen, “Hybrid Soldering 2.3D Assembly with High Reliability and Low Cost,” IEEE Journal of the Electron Devices Society, v 10, p 791-796, Sep. 2022（IF=2.523, SCI）

9. Meng-Kai Shih, Yu-Wei Huang, Guan-Sian Lin, “Next-Generation High-Density PCB Development by Fan-Out RDL Technology,” IEEE Transactions on Device and Materials Reliability, v 22, n 2, p 296-305, June 2022（IF=1.76, SCI）

10. Meng-kai Shih, Wei-hong Lai, Tse-wei Liao, Karen Chen, Dao-Long Chen, C. P. Hung , “Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages,” Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, v 12, n 2, p 279-305, Feb. 2022.（IF=1.738, SCI）

11. Meng-Kai Shih, Sean Shih, Tse-Wei Liao, Dao-Long Chen, D.S. Liu, David Tarng, “Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging,” Microelectronics Reliability, 130(2022), 114488（IF=1.589, SCI）

12. Meng-kai Shih, Tai-Kuang Lee and Jin-Gyao Chang, “Warpage modeling and characterization of intelligent power modules (IPMs),” Journal of Mechanics, v 37, p 543-550, Sep. 2021.（IF=1.12, SCI）

13. Mengkai Shih, Karen Chen, Teck Lee, David Tarng, CP Hung, “FE simulation model for warpage evaluation of glass interposer substrate packages,” Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, v 11, n 4, p 690-696, Apr. 2021.（IF=1.88, SCI）

14. Ming-Yi Tsai, Jia-Hao Yeh, Pu-Shan Huang, D. L. Chen, M. K. Shih and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, v 20, n 2, p 442-451, June 2020（IF=1.79, SCI）

15. Meng-Kai Shih, Chih-Yi Huang, Tsan-Hsien Chen, Chen-Chao Wang, David Tarng and CP Hung, “Electrical Thermal and Mechanical Characterization of eWLB, Fully-Molded Fan-Out Package and Fan-Out Chip Last Package,” Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, v 9, n 9, p 1765-1775, 2019.（IF=1.86, SCI）

16. M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, v 19, n 4, p 615-621, 2019（IF=1.79, SCI）

17. Y.-S. Lai, M.-K. Shih, C.-C. Lee and T. H. Wang, “Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages,” Microelectronics Reliability, 52(11): 2851-2855, 2012（IF=1.483, SCI）

18. H.-Y. Chang, W.-F. Pan, M.-K. Shih and Y.-S. Lai. Geometric design for ultra-long needle probe card for digital light processing wafer testing. Microelectronics Reliability, 50(4): 556-563, 2010. Invited paper to the special issue on advances in wafer level packaging (WLP). （IF=1.483, SCI）

19. A. T. Wu, C.-Y. Tsai, C.-L. Kao, M.-K. Shih, Y.-S. Lai, H.-Y. Lee and C.-S. Ku, “In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays,” Journal of Electronic Materials, 38(11): 2308-2313, 2009. （IF=1676, SCI）

20. M.-K. Shih and Y.-S. Lai, “Design optimization of needle geometry for wafer-level probing test,” IEEE Transactions on Components and Packaging Technologies, 32(2): 435-439, 2009. （IF=1.276, SCI）

21. D. S. Liu and M. K. Shih, “Application of a genetic algorithm to the design optimization of a multilayer probe card for wafer level testing ”, IEEE Transactions on Electronics Packaging Manufacturing, v 32, n 1, p 49-58, 2009（IF=1.336, SCI）

22. D.S. Liu and M.K. Shih, “An Experimental and Numerical Investigation Into Multilayer Probe Card Layout Design,” IEEE Transactions on Electronics Packaging Manufacturing, v29, issue:3, p 163-171, 2006. （IF=1.336, SCI）

23. D.S. Liu and M.K. Shih, “Experimental method and FE simulation model for evaluation of wafer probing parameters,” Microelectronics Journal, v37, issue:9, p 871-883, 2006.（IF=1.284, SCI）

24. D. S. Liu, M. K. Shih and S. M. Liu, “EXPERIMENTAL AIDED PERFORMANCE EVALUATION METHODS FOR WAFER PROBE TEST”, EXPERIMENTAL TECHNIQUES, Vol. 30, Issue 5, PP. 23-27, 2006.（IF=0.779, SCI）

25. D. S. Liu, M. K. Shih and W. H. Huang, “Measurement and Analysis of Wafer Probe Testing Contact Resistance”, Microelectronics Reliability, Vol. 47, Issue 7, PP. 1086-1094, 2006. （IF=1.483, SCI）

研討會論文(國際研討會)

1. Ian Hu; Hung-Hsien Huang; Po-Cheng Huang; Jui-Cheng Yu; Chien-Neng Liao; Meng-Kai Shih; David Tamg; C.P. Hung, “Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick,” IEEE 19th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020.

2. Dao-Long Chen ; Ian Hu ; KarenYU Chen ; Meng-Kai Shih ; David Tarng ; Dinos Huang ; JY On, “Material and Structure Design Optimization for Panel-Level Fan-Out Packaging,” IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, 2019.

3. Chan-Yuan Liu ; Jason Chien ; Yu-Chou Tseng ; Kuo-Hsien Liao ; Alex Chan ; Dao-Long Chen ; Meng-Kai Shih ; Mark Gerber, “Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding,” IEEE 69th Electronic Components and Technology Conference (ECTC) , Las Vegas, USA, 2019.

4. Huang Hung-Hsien ; Cheng-Yu Tsai ; Jung-Che Tsai ; Meng-Kai Shih ; David Tang ; CP Hung, “From Package to System Thermal Characterization and Design of High Power 2.5-D IC,” International Conference on Electronics Packaging (ICEP), Niigata, Japan, 2019.

5. Meng-Kai Shih ; Ryan Chen ; PeterBS Chen ; Ying-Chih Lee ; KarenYU Chen ; Ian Hu ; Tang-Yuan Chen ; Lung Tsai ; Eatice Chen ; Eddie Tsai ; David Tarng ; CP Hung, “Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages,” IEEE 68th Electronic Components and Technology Conference (ECTC) , San Diego, USA, 2018.

6. Dao-Long Chen ; Po-Hsien Sung ; Wei-Jie Yin ; Meng-Kai Shih ; David Tarng ; Chih-Pin Hung, “Mechanical characterization comparison as flip-chip package to fan-out package,” International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, Japan, 2018.

7. Wei-Hong Lai ; Shao-Chen Yen ; Hsin-Chih Shih ; Meng-Kai Shih ; David Tarng ; Chih-Pin Hung, “Reliability analysis of SiP module board level bending test,” International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, Japan, 2018.

8. Meng-Kai Shih ; Hsin-Chih Shih ; Ying-Chih Lee ; David Tamg ; CP Hung, “Solder joint reliability analysis for large size WLCSP,” International Conference on Electronics Packaging (ICEP), Yamagata, Japan, 2017

9. Meng-Kai Shih ; Ying-Chih Lee ; Ryan Chen ; David Tarng ; CP Hung, “Parameters study of thermomechanical reliability of board-level fan-out package,” International Conference on Electronics Packaging (ICEP), Yamagata, Japan, 2017

10. Jin-Yuan Lai ; Tang-Yuan Chen ; Ming-Han Wang ; Meng-Kai Shih ; David Tarng ; Chih-Pin Hung, “Characterization of Dual Side Molding SiP Module,” IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, USA, 2017

11. Meng-Kai Shih ; Charles Hsu ; Yungshun Chang ; Karenyu Chen ; Ian Hu ; Teck Lee ; David Tarng; CP Hung, “Warpage Characterization of Glass Interposer Package Development,” IEEE 67th Electronic Components and Technology Conference (ECTC), Lake Buena Vista, USA, 2017

12. Chang-Chi Lee ; CP ung ; Calvin Cheung ; Ping-Feng Yang ; Chin-Li Kao ; Dao-Long Chen ; Meng-Kai Shih ; Chien-Lin Chang Chien ; Yu-Hsiang Hsiao ; Li-Chieh Chen ; Michael Su ; Michael Alfano ; Joe Siegel ; Julius Din ; Bryan Black, “An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer,” IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, 2016

13. Wu-Sung Yao ; Ian Hu ; Golden Kao ; Meng-Kai Shih ; Karen Chen, “Dynamic stiffness analysis of repetitive control and applied to Advanced Metrology Analyzer,” 17th International Conference on Electronic Packaging Technology (ICEPT) ,Wuhan, China, 2016

14. Tang-Yuan Chen ; Bo-Syun Chen ; Penny Yang ; Jin-Yuan Lai ; Meng-Kai Shih, “The warpage and thermal simulation study for embedded die technology,” IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, 2016

15. Meng Kai Shih ; Ping Chi Hong, “Structural design guideline for Cu pillar bump reliability in system in packages module,” IEEE 17th Electronics Packaging and Technology Conference (EPTC), Singapore, 2015

16. Y.-S. Lai, M.-K. Shih, C.-C. Lee, T. H. Wang, B. K. Appelt and C. Cheung, “Structural design guideline for minimizing extreme low-k delamination potential in flip-chip packages with 40 nm wafer node,” In Proceedings of ICEP (11th International Conference on Electronics Packaging), pp. 172-176, Nara, Japan, 2011.

研討會論文(國內研討會)

1. 施孟鎧、陳宣予、陳道隆：「數位影像關係法(DIC)應用於電子封裝之變形分析」，中華民國力學學會年會暨第四十四屆全國力學會議，國立宜蘭大學，宜蘭縣, 2020/11/26-27。

2. 施孟鎧、劉裕豪：「覆晶封裝在熱-固耦合循環測試下之應力分析」，中國機械工程學會第三十七屆全國學術研討會，國立虎尾科技大學，雲林縣, 2020/11/20-21。

3. 顏劭丞、賴威宏、李英志、施心智、施孟鎧、唐心陸：「薄型化晶片堆疊封裝之熱變形分析」，中華民國力學學會年會暨第四十二屆全國力學會議，國立台北科技大學，台北市, 2018/11/23-24。

4. 任明華、洪鈺婷、施孟鎧、胡逸群、陳燦賢、陳宣予：「扇出型晶圓級構裝之濕-熱-固耦合應力與翹曲分析」，中國機械工程學會第三十五屆全國學術研討會，國立中正大學，嘉義縣, 2018/11/30-12/1。

5. 趙翌辰、顏劭丞、蔡靜宜、施孟鎧、唐心陸：「不同種類錫銀銅合金錫球之晶圓級晶片尺寸封裝之熱循環負載可靠度分析」，中國機械工程學會第三十五屆全國學術研討會，國立中正大學，嘉義縣, 2018/11/30-12/1。

6. 任明華、蔡承佑、施孟鎧、陳瑭原：「高性能覆晶球柵陣列封裝之熱界面材料其熱傳效益之影響」，中國機械工程學會第三十四屆全國學術研討會，國立勤益科技大學，台中市, 2017/12/1-2。

7. 廖則瑋、施心智、施孟鎧、劉德騏：「應用有限元素分析探討銀銲線迴路形狀之研究」，中國機械工程學會第三十四屆全國學術研討會，國立勤益科技大學，台中市, 2017/12/1-2。

8. 李英志、施孟鎧、陳宣予、高金利：「銅柱凸塊應用於大尺寸覆晶構裝之可靠度評估」，中國機械工程學會第三十二屆全國學術研討會，國立高雄應用科技大學，高雄市, 2015/12/11-12。

9. 施孟鎧、李長祺、賴逸少：「40 nm ILD 在熱製程中之可靠度評估分析」，第三十四屆全國力學會議論文集，G1009，國立雲林科技       大學，雲林縣, 2010。