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Electric Field Control - EOS Mystery Solved

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Specific areas:

  • IC manufacturing & test
  • PCB manufacturing & test
  • Sub-Assembly manufacturing & test
    • Like Vehicle door, Cockpits, axles, electric motors
  • OEM manufacturing & test
    • Vehicle assembly lines
    • Appliance assembly lines

EOS Guidelines available:

    • Manufacturing Guides
    • Equipment Guides
    • Product type Guides
    • Testing Guides
    • Assessment Forms

Workshops tailored to fit your needs

    • Defects. Review Design, Failure analysis, Manufacturing, Test, Control systems, Standards
    • Electric Field Control theory and practical application
    • Effective use of ionizers
    • EOS investigation processes
    • Case studies
    • IC design, manufacturing, and EOS testing
    • PCB design, manufacturing, and EOS testing
    • Vehicle design, manufacturing, and EOS testing
    • PCB manufacturing: SMT, Backend, Test
    • Automotive manufacturing & sub-assemblies
    • Security cards: Passports, Credit cards
    • Appliances
    • High quality: Medical, Aircraft, Autonomous vehicles

Case Studies

  • Cases studies are a highlight of a few interesting failures to help with the understanding of practical solutions
  • Over 700 cases investigated across a broad range from IC design to Vehicle assembly


  1. One of the most common IC failures are "VDD shorts". It can be immediate failures in Tier1 PCB manufacturing or Field failures. The Microprocessors and Micro-controllers are the most common victims of VDD shorts. And the root cause may surprise you. The highest risk areas is a PCB discharge event on the In-Circuit Tester, ICT. The ICT fixture has metal pogo pins that contact near the pin of the IC. The purpose is to verify the decoupling capacitor on the VDD pin. However, because the pogo pin is so close to the IC pin it easy to have a high energy injection from a PCB discharge event. The solution is simple. Use Electric Field Control on the ICT tester.