Youngtronics is a world class quality control manufacturer company, a Leader in providing electronics manufacturing services including contract design, material procurement, documentation, assembly and testing.  Our mission is to provide total customer satisfaction through teamwork, continuous improvements and with just in time manufacturing operations.

Our ability to provide the exact, techno savvy  and cost saving solutions  to our customer’s most challenging requirements and our access to the latest technology and infrastructure has established us well ahead in the field. Youngtronics conducts its full service contract manufacturing operations in a Static free, Climate control building.

We extend our support beyond our contract.

We believe in long time relationships built on trust and thorough support with an open communication and a clear vision. We give a total commitment to our job and our customers as they are the most important component in our business. We assemble our commitments with a highly skilled team, by using innovative process and latest technology and by  generating quality products. We take pride in our services .Our attention to details and our access to the latest technology without shifting our focus from our expertise in traditional processes has been our strongest asset.

We work as a Partner for long term relationship

Youngtronics is committed for the result well beyond the customer expectations. We strive to provide quality service and technical support above the traditional electronic manufacturing services (EMS) provider. Youngtronics has commitment to customer service, quality, traceability and supply chain inventory management system.

We produce and ship locally out of our Production facility in Wixom, Michigan, US. We maintain the Product Quality and delivery in time with our leading edge equipment and technical knowledge . We provide an immediate response to our Customers.

  
                                                                         
 
  
  
 CAPABILITIES
 
Surface Mount Technology.
Lead Free ROHS
Down to 12 mil Ultra fine Pitch
Through Hole
Mixed Technology.
BGA &bMicro BGA
100% Inspection
Chip Scale Packaging
Flip Chips
Flex Circuits
Thin Rigid Substrates
Double Sides and Intusive Reflow Process
No Clean and Water Soluble Soldering Capabilities
In Circuit Testing
Functional Testing
Cable Fabrication
Box Build
Electromechanical