HB-LED Equipment Automation TF

Charter:
  • Define physical interfaces of substrate carriers used in HB-LED manufacturing.
  • Define physical interfaces of process and metrology tools and of wafer / substrate carriers used in HB-LED manufacturing.
  • This task force will sponsor forums to bring stakeholders together to define the wafer/substrate characteristics required for wafer/substrate handling wafers, substrate carriers, HB-LED process interactions, and metrology interfaces.
Scope:
This effort will require some initial discussions around a common vision for an HB-LED factory to which these standards shall apply. I don’t believe that a common Automation Vision should be a required output of this task force.  Although, the standards process would benefit greatly from any level of consensus in this area.

Carrier-related activities:
Start with 150 mm diameter wafers. Include:
  • Shipping carriers –
    • from wafer supplier to epi processor, and
    • from epi processor to front-end HB-LED device fab
  • Automation carriers –
  • Process tool input and output
  • Factory automation interfaces
  • Robotic handling interfaces
  • Process carriers
    • Liquid, gaseous and vacuum environment
  • Issues:
  • Wafer diameter
  • Wafer thickness
  • Wafer flat
  • Wafer Capacity.
  • Wafer Bow > 1mm
  • Slot pitch and related dimensions
  • Equipment interface
  • ID – Traceablity
  • Contamination Control

Automation-related activities:
Start with 150 mm diameter wafers tools. Include shipping system, and physical interfaces for
  • Process and Metrology Tools
  • End Effectors
  • Tool-to-carrier interfaces 
  • Substrate Carriers
  • Shipping carriers
    •  from wafer supplier to epi processor, and
    •  from epi processor to front-end HB-LED device fab
  • Automation carriers
    • Process tool input and output
    • Factory automation interfaces
    • Robotic handling interfaces
  • - Process carriers
    • Liquid, gaseous and vacuum environment
  • Issues
  • Wafer diameter, thickness
  • Rectangular substrate dimensions
  • Wafer/Substrate Capacity
  • Wafer Bow > 1mm
  • Slot pitch and related dimensions
  • Equipment interface
  • ID – Traceability
  • Contamination Control

Leaders:
  • Daniel Babbs (Brooks Automation)
  • Jeff Felipe (Entegris)