Charter:- Define physical interfaces of substrate carriers used in HB-LED manufacturing.
- Define physical interfaces of process and metrology tools and of wafer / substrate carriers used in HB-LED manufacturing.
- This task force will sponsor forums to bring stakeholders together to define the wafer/substrate characteristics required for wafer/substrate handling wafers, substrate carriers, HB-LED process interactions, and metrology interfaces.
Scope:This effort will require some initial discussions around a common vision for an HB-LED factory to which these standards shall apply. I don’t believe that a common Automation Vision should be a required output of this task force. Although, the standards process would benefit greatly from any level of consensus in this area. Carrier-related activities:Start with 150 mm diameter wafers. Include: - from wafer supplier to epi processor, and
- from epi processor to front-end HB-LED device fab
- Process tool input and output
- Factory automation interfaces
- Robotic handling interfaces
- Liquid, gaseous and vacuum environment
- Wafer diameter
- Wafer thickness
- Wafer flat
- Wafer Capacity.
- Wafer Bow > 1mm
- Slot pitch and related dimensions
- Equipment interface
- ID – Traceablity
- Contamination Control
Automation-related activities:Start with 150 mm diameter wafers tools. Include shipping system, and physical interfaces for - Process and Metrology Tools
- End Effectors
- Tool-to-carrier interfaces
- Shipping carriers
- from wafer supplier to epi processor, and
- from epi processor to front-end HB-LED device fab
- Automation carriers
- Process tool input and output
- Factory automation interfaces
- Robotic handling interfaces
- - Process carriers
- Liquid, gaseous and vacuum environment
- Wafer diameter, thickness
- Rectangular substrate dimensions
- Wafer/Substrate Capacity
- Wafer Bow > 1mm
- Slot pitch and related dimensions
- Equipment interface
- ID – Traceability
- Contamination Control
Leaders:- Daniel Babbs (Brooks Automation)
- Jeff Felipe (Entegris)
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