HB-LED Assembly TF

Define physical and packaging attributes of die-level conductor elements as they relate to being  optimized for handling and processing by common assembly and other equipment, employing automatic material handling, pattern recognition, interconnect, and assembly systems that are used in HB-LED manufacturing.

Start with automated package assembly of HB LEDs from 150 mm diameter HB LED wafers. Include attributes that satisfy needs for:
a) material handling of wafers and subsequent intermediate assembly step formats as they are presented to or exit from assembly equipment such as pick and place, die attach, and wire bond
b) Unambiguous identification of a conductor element’s physical orientation on a strip or carrier element, and its relationship to the HB-LED chip substrate’s location, for purpose of appropriate future interconnect or assembly requirements.

Consider various common packaging and processing formats, either stand alone or in carriers, e.g. LEDs on ceramic substrates or other materials, long-axis strips such as lead frames

Paul Reid (Kulicke & Soffa)
Subpages (2): 2011Feb03 2011Mar31