SNARFs

Links to 3DS-IC TFOFs and SNARFs:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF!OpenForm&Start=1&Count=500&Expand=1&Seq=1


The following SNARF was approved by the NA 3DS-IC Committee at SEMICON West 2012 (July 10):
  • Doc. #5447
    • Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures

The following SNARFs were approved by the Taiwan 3DS-IC Committee on June 6:
  • Doc. #5473
    • New Standard: Guide for Alignment Mark for 3DS-IC Process
  • Doc. #5474
    • New Standard: Guide for CMP and Micro-bump Processes for Frontside TSV Integration

The following SNARFs were approved by the NA 3DS-IC Committee during the NA Standards Spring 2012 meetings on April 3:
  • Doc. #5409
    • New Standard: Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
  • Doc. #5410
    • New Standard: Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures

The following SNARFs were approved by the North America (NA) 3DS-IC Committee at SEMICON West on July 12:
  • Doc. #5269
    • New Standard: Guide for Terminology for Measured Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
  • Doc. #5270
    • New Standard: Guide for Measuring Voids in Bonded Wafer Stacks

The following SNARFs were approved by the NA 3DS-IC Committee during the NA Standards Spring 2011 meetings on March 29
:
  • Doc. #5173
    • New Standard: Specification for Parameters for Bonded Wafer Stacks
  • Doc. #5174
    • New Standard: Specification for Identification and Marking for Bonded Wafer Stacks
  • Doc. #5175
    • New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers

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