3DS-IC Bonded Wafer Stacks TF

The BWS Task Force will actively create and/or modify specifications that reflect bonded wafer stacks parameters and the wafer bonding process.

  • Identify new wafer parameters that reflect adequate ranges for bonded wafer stacks
  • Modify/create document to reflect adequate ranges for bonded wafer stacks
  • Identify other SEMI standards that are adversely affected by BWS parameters
  • Update referenced standards: create/modify standards to reflect BWS parameters¬†
The minutes for the most recent past meeting and the agenda for the next meeting can be found in subpages to this page; these subpages are named by meeting date.  Agendas and minutes from prior meetings can be found in the "Meeting Archives" page.

TF Leader:
Rich Allen (SEMATECH)