3DS-IC Thin Wafer Handling TF

  • Develop standards for reliable handling and shipping of thin wafers, dies (e.g., Micro-pillar Grid array -MPGA) used in 3DS-IC high volume manufacturing (HVM)
  • Define thin wafer handling requirements including physical interfaces used in 3DS-IC manufacturing.
  • Define shipping requirements, including packaging, reliability,  and other relevant criteria. This will also include MPGA ship/handle requirements


Formulate a common set of requirements and priorite  critical areas for standardization, resulting in a short-list of required standards (inspection, shipping etc) in the topics listed below. Other topics may be added based on additional inputs
  • Thin wafer and Die Shipping  related activities: Examples
  • Shipping carriers for thin wafer – wafer cassette, box or frame
  • Shipping carrier for dies (MPGA)
  • Reliability Test methods
  • Transportation vibration testing
  • Drop-shock
  • Other – new tests?
  • Thin wafer handling-related activities:Examples
    • Process and Metrology Tools and Test methods
  • Whole wafer inspection for damage (crack, break etc)Macro level
  • Damage to features – microbump, pad etc micro level
    • Universal carrier concept
      •  Automation

TF Leaders:

Urmi Ray (Qualcomm)
Raghunandan Chaware (Xilinx)
Richard Allen (NIST/SEMATECH)