Development of SEMI 5410, archives

  • The latest version of SEMI Draft Document 5410, New Standard:  Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures, is posted as: SEMI_Doc_5410_v_2.1.pdf

  • The minutes of the meetings that were held during the development of this document are posted below as subpages.


We plan to seek approval for "yellow ballot" at the upcoming SEMI Standards meetings, Fall, 2012

David Read,
Oct 22, 2012, 6:01 PM