3DS-IC Inspection & Metrology TF

Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks,  and dies used in the 3DS-IC manufacturing process.

Examples of needed standards include (but are not limited to):
  • TSV physical properties i.e. depth, top, bottom CD, side wall….
  • Bonded wafer stack properties i.e. overlay, bond inspection
  • Defect metrology
  • Dies ???

TF Leaders:
Yi-Shao Lai (ASE)
David Read (NIST)
Chris Moore (Semilab)
Victor Vartanian (SEMATECH)