SEMI 3DS-IC Technical Committee
(Three-dimensional Stacked Integrated Circuits)

To explore, evaluate, discuss, and create consensus-based  specifications, guidelines, and practices that, through voluntary compliance, will;
  • promote mutual understanding and improved communication between users and suppliers of 3DS-IC materials, carriers, equipment, automation systems and devices
  • enhance the manufacturing efficiency, capability and shorten 3DS-IC time-to-market
  • reduce manufacturing cost in the 3D-IC industry.

  • To include liaisons and synergies with other SEMI technical committees for the development of 3DS-IC related standards
  • The 3DS-IC standards committee scope is limited to exploring and developing standards that pertain to common criteria, guidelines, methods for control and comparison of 3DS-IC-related materials, carriers, equipment  and automation systems. It will seek to support the international need for increasing 3DS-IC product / process yield and reducing related 3DS-IC costs
  • The 3D-SIC committee will also facilitate any industry initiatives towards product standardization needs

North America 3DS-IC Committee Information:
Task Forces:

  • Wafer Bonded Stack TF
  • Inspection and Metrology TF
  • Thin Wafer Handling TF (disbanded November 4, 2014)

  • Sesh Ramaswami (Applied Materials)
  • Richard Allen (NIST)
  • Chris Moore (BayTech-Resor)

SEMI Staff:

Paul Trio (ptrio@semi.org)