Thin film databook

You'll find here the published values for the mechanical properties of submicron thin films. These films are usually deposited by Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) or Sol-gel.  Please note that the mechanical properties often vary depending on the thickness and deposition conditions.

Click on a material for more details.

     Young's
Modulus

Yield
strength

 Tensile / Ultimate
strength

 Hardness Lab-on-chip
 Metals        
 *  Aluminum Al
69..85 GPa 87..625 MPa
124..375 MPa
  F1 lab-on-a chip
   Copper Cu
86..173 GPa   120..480 MPa  330..800 MPa
 2.8 .. 3.5 GPa F1 lab-on-a chip
   Gold Au
 40..80 GPa
55..260 MPa
200..780 MPa
  F1 lab-on-a chip
   Nickel Ni
 156..231 GPa
320..1550 MPa
440..2470 MPa
  F1 lab-on-a chip
 *  Titanium Ti
110 GPa  910 MPa
   4.4 .. 6.3 GPa

   Tungsten W
400..440 GPa
    14 .. 15 GPa

 Alloys        
   Al / Cu 0,5%
 74 GPa
172 MPa
   
 *  Al / Si 1%
70 GPa    950 MPa at 2%
 
   Ti / Al
      3.2 .. 4.6 GPa

 Silicon-based        

 Silicon Si
158 GPa

1.4..4.9 GPa

 *  Polysilicon Si
95..181 GPa

1.19 GPa
  F1 lab-on-a chip
   Silicon Carbide SiC
395..470 GPa
   2.1 .. 2.7 GPa
 
 *  Silicon Nitride Si3N4
104...380 GPa
   1.51 ..5.88 GPa
  F1 lab-on-a chip
   Silicon dioxide SiO2
 64..83 GPa
  600 MPa
 
 Carbon-based        
   Ta-C / DLC
60..800 GPa
  0.8 .. 5.3 GPa   F1 lab-on-a chip
   Micrograined 830..1250 GPa
  0.5 . .2.7 GPa
 
   Nanograined
 510..1150 GPa
     
   UNCD  916..970 GPa

0.9 .. 5.0 GPa  
 Oxides        
   Zinc oxide ZnO
140..170 GPa


 
   Tin oxide SnO2



 
 * denotes material characterized with the technology of MEMS Instruments.

See our sources, and other material databases.
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