Yi-Shao Lai received the Ph.D. degree in engineering mechanics from The University of Texas at Austin in 2002, and M.S and B.S. degrees in civil engineering from National Central University, Jhongli, Taiwan. He is currently pursuing an M.S. degree in engineering management at National Cheng Kung University, Tainan, Taiwan. Dr. Lai is a Director with Group R&D of Advanced Semiconductor Engineering (ASE), Inc., where he is leading Central Product Solutions with a focus on strategic planning and development of next-generation and mainstream electronic and photonic packaging, substrate technologies, as well as profitable new technologies. Functions include business development strategies, manufacturing technology innovations, thermal and reliability designs, and experimental and numerical material characterizations. Dr. Lai is an Adjunct Assistant Professor with National Sun Yat-sen University. He is a Board Member of IMAPS Taiwan, Chair of the iNEMI Technology Working Group for Modeling, Simulation, and Design Tools, and Co-Chair of SEMI 3DS-IC Inspection and Metrology Standardization Task Force and SEMI Taiwan 3DS-IC Standards Technical Committee. He is an Associate Editor for Microelectronics Reliability, a Guest Editor for IEEE Transactions on Components and Packaging Technologies and ASME Transactions Journal of Electronic Packaging, and serves on the Editorial Advisory Board of Recent Patents on Electrical Engineering. Dr. Lai is an IEEE Senior Member and a recipient of the Outstanding Technical Achievement Award by IEEE Tainan Section. He was named Outstanding Young Engineer by Electronic & Photonic Packaging Division of American Society of Mechanical Engineers (ASME EPPD), Chinese Institute of Engineers, and Chinese Society of Mechanical Engineers. Dr. Lai has over 550 technical publications and is the inventor of more than 55 patents.