Curriculum Vitae

Work

2011 Feb-Present

  • Intersil, Milpitas Headquarter, California, US.
  • Sr. Packaging Engineer, Packaging and Technology Development Division

2010 Oct-2011 Feb

  • Institution of Energy Efficiency, University of California, Santa Barbara, Santa Barbara, US.
  • Researcher, Center of Energy Efficient Materials

2004 Sept~2010 Aug

  • University of California Santa Cruz, California, US.
  • Sr. Research Assistant, Quantum Electronics Group

2009 Jun~2010 Apr (My excursion away from the PhD study)

  • Tessera Technologies, San Jose, California, US.
  • R&D ,System integration of ElectroHydrodynamic Cooling Units, in Micro-Electronics Division

2003 Sept~2004 July

  • National Opto-Electronics Laboratory, Wuhan, China.
  • Research Assistant

2003 June~Sept (Fun summer internship, from where I learned the basics about Quality Control)

  • Motorola Electrics Ltd., Tianjin, China.
  • Intern

Education

2004~Present

  • University of California Santa Cruz, California, US.
    • Ph.D Candidate in Electrical Engineering
    • M.S. in Electrical Engineering

2000~2004

  • Huazhong University of Science and Technology, Wuhan, China.
    • B.S. in Opto-Electronics Engineering (Honor Graduate) 
Awards and Honor
  • 2008 ATW Student Award, International Microelectronics and Package Society, Palo Alto, California, US.
  • 2004 Regent Fellowship, University of California Santa Cruz, Santa Cruz, California, US.
  • 2003 Excellent Leading Student, Huazhong University of Science and Technology, Wuhan, China.
  • 2005~present Member of Material Research Society
  • 2004~present Student Member of Institute of Electrical and Electronics Engineers

    Language
    • Fluent in English, Mandarin, Cantonese