Design Lab 1 2008/2009

1. Im Laufe unserer Projektplanungen sind einige Frage aufgekommen, die Sie uns hoffentlich beantworten können:
1. Wie dick sind die Wafer? The wafer will be 380 micrometers (380 µm) thick. Furthermore, you will have half a wafer space for your design (2 groups per wafer). Remember to leave free space at the edge of the 100 mm diameter wafer, approximately 2 mm along the straight line in the middle of the wafer (then 2 x 2 = 4 mm), and 10 mm along the round edge of the wafer. See attached file DesignAreaWafer.pdf in Downloads.
2. Welche Eigenschaften haben die optischen Komponenten, die wir positionieren sollen (Größe, Gewicht, Form... ) The optical components should of course be small. Take a look at Industrial Technologies for an example. They have ball lenses from 250 µm to 8000 µm. You are expected to invent. Be pragmatic: you have 3 months, so make it general enough to have potential, and specific enough to have success!
3. Welche Kenngrößen (Aspektverhältnis...) hat der Silicon ICP Process? Very good question. The ICP is a tricky thing. Avoid beam widths less than 10 µm, better to stay at 25 µm and above (Laura recommends one should not go below 100µm!). The reason is the rather bad vertical angle of the etcher. Also remember that the width of the cavity greatly affects the etch front speed. Having a uniform width helps to get better quality parts.