Dear madam, dear sir,
As every year for the past 16 years, the ISBS is organizing an international conference on engineering applied to the skin ; in 2009 this event will take place from the 9th till the 12th of September in Besançon, France. The meeting will consist of oral communications given by invited experts in the field and communications selected from submitted abstracts. Poster exhibition and time for discussions will be arranged.
We hope this conference will contribute to a better understanding of skin engineering and to fruitful discussions leading to future collaborative projects.
This meeting is organized under the aegis of the International Society for Biophysics and Imaging of the Skin, in collaboration with the Department of Dermatology and the Research and Studies Center on the Integument (CERT) of Besançon.
We hope that you will have a very pleasant stay in Besançon.
Please accept, dear madam, dear sir, the assurance of my cordial greetings.
Professor Philippe Humbert
President of ISBS |
|
|
Welcome message |
