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Yes I misspelled inventor...

About my self (random thoughts):

My name is Scott T. Block. I graduated from the University of Illinois Urbana-Champaign with a B.S. in Mechanical Engineering. Worked a little over a year for United Conveyor Corporation, and graduated from Texas Tech University, December 2010, in good old Lubbock, Tx, with a master's degree in Electrical Engineering. My thesis project was a spin off of Estimation of Density originally started for my image processing class (link located under Projects: Engineering and see Publications for master's independent study project below). I have decided to go to University of California at Davis to pursue a PhD in Electrical and Computer Engineering (which I'm very excited about). [MORE]

Journal Publications:

None, yet :)!

Conference Publications:

[2] Yiran, Li, Scott T. Block, Li Lu, Changzhi Li, "All-CMOS Low Voltage Temperature Sensor Front-End and Bandgap Circuit Using Bulk-Driven Technology," Semiconductor Research Corporation (SRC) Tech Conference, Austin, Tx, Sep. 2011 [pdf]

[1] Scott T. Block, Yiran Li, Yi Yang, Changzhi Li, “0.6-2.0 V, ALL-CMOS Temperature Sensor Front-End Using Bulk-Driven Technology,” IEEE DCAS 2010, Dallas, TX, October 17-18, 2010. [pdf] [IEEE]

Works in Progress:

[2] Scott T. Block, Yiran Li, Changzhi Li, Semi-configurable temperature sensor using diode array. The fabricated chip in IBM 90nm process should be arriving Nov-Dec 2011. The version in 90nm process should be come in a few months, but for both cases (0.5um bellow and 90nm) I won't be around to test it. Then hopefully we'll try and get a nice paper out of them.

[1] Scott T. Block, Yiran Li, Changzhi Li, Semi-configurable temperature sensor using Schottky diode array. The fabricated chip in AMI 0.5um process has arrived August 2011 (see image below).