Publications
Return to Dr. Hasan M Nayfeh's web page Dr. Hasan Nayfeh
2011
- (30) R. Arora, S. Seth, J.C.H. Poh, J. D. Cressler, A.K. Sutton, H. M. Nayfeh, G.L. Rosa, G. Freeman, "Impact of Source/Drain contact and gate finger spacing on the RF reliability of 45-nm RF nMOSFETs" 2011 Reliability Physics Symposium, Apri. 2011.
- (29) R. Arora, En Xia Zhang, S. Seth, J. D. Cressler, D.M. Fleetwood, R.D. Schrimpf, G.L. Rosa, H.M. Nayfeh, G. Freeman, "Trade-Offs Between RF Performance and Total-Dose Tolerance in 45-nm RF-CMOS, IEEE Transactions on Nuclear Science", Vol. 58, No. 6, pp. 2830-7
2010
- (28) N. Wadje, V. Neeli, R. P. Jindal, H. M. Nayfeh, R. Todi, “Investigation of kink-induced RF Channel Noise in sub-100nm PDSOI MOSFETs, 2010 IEEE SOI Conference.
- (27) R. Arora, K. Moen, A. Madan, J. Cressler, A.K. Sutton, H. M. Nayfeh, “Impact of Body Tie and S/D Contact Spacing on The Hot Carrier Reliability of 45-nm RF MOSFETS”, 2010 CMOS IIRW Conference.
2009
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(26) H. M. Nayfeh, N. Rovedo, A. Bryant*, S. Narasimha, A. Kumar, X. Yu, Y. Lee, A. Kumar**, J. Sleight** R. Robison*, N. Su, J. Yu, W. Rausch, H. Mallela, G. Freeman, Impact of Asymmetric Doping on Nanoscale n-type MOSFETs and Circuit Performance, IEEE Transactions on Electron Devices, December. 2009. asymmetric_TED.pdf
2008
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(25) H. M. Nayfeh, Channel Strain Engineering for High Performance CMOS Technology, 2008 IEEE RTP Conference Channel_Strain_HPCMOS_Tech_HMNAYFEH_.pdf
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(24) X. Ouyang, S. J. Jeng, I. Ahsan, A. Waite, K. Barth, H. M. Nayfeh, Y. Wang, "Yield Monitor for Embedded-SiGe Process Optimization" 2008 ICSICT Conference. eSiGemonitorICSICT.pdf
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(23) J. R. Holt, E. C. Harley, T. N. Adam, S. J. Jeng, K. Tabakman, R. Pal, H. M. Nayfeh, L. Black, J. Kempisty, M. Stoker, D. Schepis, "SiGe Selective Epitaxy: Process Development for High Performance 45nm CMOS Technology" Proceedings of the 2008 ECS Conference ECS_2008.pdf
2007
- (22) B. Yang, A. Waite, H. Yin*, J. Yu*, L. Black, D. Chidambarrao*, A. Domenicucci*, X. Wang*, S.H. Ku*, Y. Wang*, H.V. Meer, B. Kim*, H. M. Nayfeh*, S.D. Kim*, K. Tabakman*, R. Pal, K. Nummy*, B. Grene*, P. Fisher, J. Liu*, Q. Liang*, J. Holt*, S. Nrasimha*, Z. Luo*, H. Utomo*, X. Chen*, D. Park*, C.Y. Sung*, R. Wachnik*, G. Freeman*, D. Schepis*, E. Maciejewski*, M. Khare*, E. Leobandung*, S. Luning, P. Agnello*, (110) Channel, SiON Gate-Dielectric PMOS with Record High Ion=1 mA/um Through Channel Stress and Source Drain External Resistance (Rext) Engineering, 2007 IEEE Electron Devices Meeting (IEDM) IEDM-latenewsabstract-Sept-17th-07.pdf
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(21) A. Domenicucci, J. Li, C. Murray, D. Chidambarrao, A. Madan, J. Holt, and H. M. Nayfeh, " Measuring Channel Strain in MOSFET Devices Using TEM Techniques", ASME Applied Mechanics and Materials Conference June 3-7, 2007, University of Texas at Austin .
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20) H. M. Nayfeh, S. Jeng, S. Narasimha, S. Butt, R. Pal, A. Waite, K. Tabakman, J. B. Johnson, J. Liu, J. Holt, T. Adam, A. Madan, A. Domenicucci, "Hole Transport in Nanoscale p-type MOSFET SOI Devices with High Strain" 2007 IEEE Device Research Conference, June 21-23, 2007, University of Notre Dame South Bend, Indiana Hole_Transport_Nanoscale_IBM_NAYFEH_.pdf
2006
(19) S. Narasimha, K. Onishi, H. M. Nayfeh, et al.. “High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography”, 2006 IEEE Electron Devices Meeting IEDM_45nm_technology_2006.pdf
(18) H. M. Nayfeh, D. V. Singh, J. M. Hergenrother, J. W. Sleight, Z. Ren, O. Dokumaci, L. Black, D. Chidambarrao, R. Venigalla, J. Pan, W. Natzle, B. L. Tessier, J. A. Ott†, M. Khare, K. W. Guarini†, M. Ieong†, W. Haensch, “Effect of Tensile Uniaxial Stress on the Electron Transport Properties of Deeply-Scaled Fully-Depleted SOI (FD-SOI) n-type MOSFETs, 2006 IEEE Electron Device Letters, Vol. 27, No. 4, April 2006, pp. 288-290 hnayfeh_utsoi_ibm.pdf
2005
(17) W-H. Lee, A.Waite H. Nii, H. M. Nayfeh, et al. “High Performance 65 nm SOI Technology with Enhanced Transistor Strain and Advanced-Low-K BEOL, 2005 IEEE Electron Devices Meeting HMN_IEDM_2005.pdf
(16) D. V. Singh, J. M. Hergenrother, J. W. Sleight, Z. Ren, H. M. Nayfeh, O. Dokumaci, L. Black D. Chidambarrao; R. Venigalla, J. Pan, B. L. Tessier, A. Nomura, J. A. Ott, M. Khare.; K. W. Guarini, M. Ieong, W. Haensch, "Effect of contact liner stress in high-performance FDSOI devices with ultra-thin silicon channels and 30 nm gate lengths", 2005 SOI Conference Proceedings, pp. 178-179, HMN_SOI_2005.pdf
2004
(15) E. P. Gusev, C. Cabral, B. P. Linder, Y. I. Kim, K. Maitra, E. Cartier, H. M. Nayfeh, et al. “Advanced Gate Stacks with Fully Silicided (FUSI) Gates and High-K Dielectrics: Enhanced Performance at Reduced Gate Leakage”, 2004 IEEE Electron Devices Meeting HMN_IEDM_2004.pdf
(14) E.P. Gusev, C. Cabral, Y. H. Kim, B. P. Linder, E. Cartier, S.Zafar, P. Jamison, H. Nayfeh, S. Fang, "Fully Silicided (FUSI) Gate Technology as a Metal Gate Option for Advanced CMOS. ECS 2004. HMN_ECS_FUSIpdf.pdf
(13) G. Xia, H. M. Nayfeh, M.J. Lee, E. A. Fitzgerald, D.A.Antoniadis, J.L.Hoyt, J.Li, D.H. Anjum, R. Hull “Impact of Ion Implantation Damage and Thermal Budget on Mobility Enhancement in strained Si n-MOSFETs”, IEEE Transactions on Electron Devices, Dec. 2004, Vol. 51, No. 12, pp. 2136-2144. HMN_implant_damage_ted2005.pdf
(12) H. M. Nayfeh, J. L.Hoyt, D.A. Antoniadis, “A Physically-Based Analytical Equation for the Threshold Voltage of strained Si n-MOSFETs”, IEEE Transactions on Electron Devices, Dec. 2004 , Vol. 51, No. 12. HMN_TED_VOL51_NO12_DEC2004.pdf
2003
(11) H. M. Nayfeh, C. W. Leitz, A. J. Pitera, J. L. Hoyt, E. A. Fitzgerald, D. A. Antoniadis, “Influence of High Channel Doping On The Inversion Layer Electron Mobility in Strained-Si n-MOSFETs, April 2003, IEEE Electron Device Letters HMN_EDL_VOL24_NO4_APR2003.pdf.
(10) G. Xia, H. M. Nayfeh, M.J. Lee, E. A. Fitzgerald, D.A.Antoniadis, J.L.Hoyt, J.Li, D.H. Anjum, R. Hull “Impact of Ion Implantation Damage and Thermal Budget on Mobility Enhancement in strained Si n-MOSFETs”, 2003 Electronic Materials Conference.
(9) H. M. Nayfeh, J. L. Hoyt, D. A. Antoniadis, “Investigation of Scaling Methodology of strained Si n-MOSFETs Using a Calibrated Transport Model, 2003 IEEE Electron Devices Meeting (IEDM).HMN_IEDM_2003.pdf
(8) Z. Cheng, J. Jung, M. L. Lee, H. M. Nayfeh, A. J. Pitera, J. L. Hoyt, E. A. Fitzgerald, D. A. Antoniadis, "SiGe-On-Insulator (SGOI): Two Structures for CMOS Application, SMA Conference Proceedings 2003. SMA-2003-conf.pdf
2002
(6) H. M. Nayfeh, J. L. Hoyt, C. W. Leitz, A. J. Pitera, E. A. Fitzgerald, D. A. Antoniadis "Electron Inversion Layer Mobility in strained-Si nMOSFETs with high channel doping achived by ion implantation, 2002 Device Research Conference (DRC), Santa Barbara California. HMNDRC2002.pdf
(10) J. L. Hoyt, H. M. Nayfeh G. Xia, S. Eguchi, T. Drake, E. A. Fitzgerald, D. A. Antoniadis, “Strained Silicon MOSFET Technology”, 2002 IEEE Electron Devices Meeting HMN_IEDM_2002.pdf
(5) H. Wakabayshi, G. Samudra, I. Djomehri, H. M. Nayfeh, D. A. Antoniadis, “Supply-Voltage Optimization for Below 70 nm Technology Node MOSFETs” IEEE Transactions on Semiconductor Manufacturing, Vol. 15, No. 2, p. 151-157, May 2002.ITSM_VOL15_NO2_MAY2002.pdf
(4) S. Eguchi, H. M. Nayfeh, C. W. Leitz, E. A. Fitzgerald, J. L. Hoyt, “Diffusion of Ion Implanted N-type Dopants in Silicon Germanium Alloys” 2001 Electronic Materials Conference, EMC.
1994-1997
(3) W. H. Thompson, Z. Yamani, H. M. Nayfeh, M-A. Hasan, J. E. Greene, M. H. Nayfeh, “Growth of germanium on porous silicon (001)” Advances in Microcrystalline and Nanocrystalline Semiconductors- 1996. Symposium Mater. Soc. 255-260 (1997) Ge_porousSi.pdf
(2) J. Hilliard, H. M. Nayfeh, M. H. Nayfeh, Re-establishment of photoluminescence in Cu quenched porous silicon by acid treatment, Journal of Applied Physics, April 15, 1995, Vol. 77, No. 8, pp. 4130-4132. PL_porousSi_HMN_JAP.pdf
- (1) J. Hilliard, D. Andager, L. Abu Hassan, H. M .Nayfeh, M. H. Nayfeh, "Infrared Spectroscopy and Secondary Ion Mass Spectrometry of Luminescent, nonluminescent, and metal quenched porous silicon", Journal of Applied Physics, August 15, 1994, Vol. 76, No. 4 pp. 2423-2428. char_porousSi_HMN.pdf